Integrated circuit package system with redistribution layer

1. An integrated circuit package system comprising:

providing a base device;

attaching a base interconnect to the base device, the base interconnect with a base ball-end having an offset from a plane of a base back side of the base device;

applying an encapsulant over the base device and the base interconnect; and

forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.

2. The system as claimed in claim 1 wherein attaching the base interconnect includes forming a base ball-end substantially coplanar to a plane of a base back side of the base device.

3. The system as claimed in claim 1 wherein attaching the base device includes attaching more than one of a through-silicon-via device.

4. The system as claimed in claim 1 further comprising attaching a stack device over the base device.

5. An integrated circuit package system comprising:

providing a base device having a base front side and a base back side;

attaching a base interconnect to the base front side and having a base ball-end near the base back side;

applying an encapsulant over the base device and the base interconnect with the base back side and the base ball-end substantially exposed;

forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate; and

attaching a package connector over a side of the re-routing film opposite the base device.

6. The system as claimed in claim 5 wherein applying the encapsulant includes forming an encapsulant cavity on a side opposite the re-routing film.

7. The system as claimed in claim 5 further comprising applying a wire-in-film material over the base device.

8. The system as claimed in claim 5 further comprising attaching a stack device over the base device wherein a stack connector of the stack device is on a side opposite the base device.

9. The system as claimed in claim 5 further comprising attaching a stack device over the base device wherein the stack device is an integrated circuit package.

10. An integrated circuit package system comprising:

a base device;

a base interconnect connected to the base device, the base interconnect with a base ball-end having an offset from a plane of a base back side of the base device;

an encapsulant over the base device and the base interconnect; and

a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.

11. The system as claimed in claim 10 wherein the base interconnect includes a base ball-end substantially coplanar to a plane of a base back side of the base device.

12. The system as claimed in claim 10 wherein the base device includes more than one of a through-silicon-via device.

13. The system as claimed in claim 10 further comprising a stack device over the base device.

14. The system as claimed in claim 10 further comprising:

the base device has a base front side and a base back side;

the base interconnect is attached to the base front side and having a base ball-end near the base back side;

the encapsulant is over the base device and the base interconnect with the base back side and the base ball-end substantially exposed;

the re-routing film is over the encapsulant, the base back side, and the base ball-end for connectivity without a substrate; and

a package connector is over a side of the re-routing film opposite the base device.

15. The system as claimed in claim 14 wherein the encapsulant includes an encapsulant cavity on a side opposite the re-routing film.

16. The system as claimed in claim 14 further comprising a wire-in-film material over the base device.

17. The system as claimed in claim 14 further comprising a stack device over the base device wherein a stack connector of the stack device is on a side opposite the base device.

18. The system as claimed in claim 14 further comprising a stack device over the base device wherein the stack device is an integrated circuit package.