IP Library Granted Patent US 8,186,661
Granted Patent B2
US 8,186,661 · App. 12/211,516 · Granted May 29, 2012

Wafer holder for supporting a semiconductor wafer during a thermal treatment process

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Quick Facts
Patent No.
US 8,186,661
App. No.
12/211,516
Granted
May 29, 2012
Kind
B2
Abstract

A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process. The wafer holder includes at least three wafer supports. Each wafer support includes an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage the semiconductor wafer when the wafer rests on the wafer supports.

Claims (16)

1. A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process, said wafer holder comprising at least three wafer supports, each wafer support comprising an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage said semiconductor wafer when the wafer rests on the wafer supports, wherein at least some of the fibers of at least one wafer support are arranged to form a wool body.

2. A wafer holder as set forth in claim 1 wherein the wool body has first and second opposite ends, the first end is secured to the shaft, and the second end is spaced from the shaft by a distance in a range from about 1 mm to about 5 mm.

3. A wafer holder as set forth in claim 2 wherein the wool body has a total volume in a range from about 15 mm 3 to about 100 mm 3 .

4. A wafer holder as set forth in claim 1 wherein the fibers have an average diameter in a range from about 15 microns to about 50 microns.

5. A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process, said wafer holder comprising at least three wafer supports, each wafer support comprising an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage said semiconductor wafer when the wafer rests on the wafer supports, wherein the shaft has a circumferential sidewall defining a cavity extending axially into the shaft at one end of the shaft and the fibers are at least partially received in said cavity, and wherein said sidewall has a plurality of openings extending through the sidewall to reduce thermal conductivity of the sidewall.

6. A wafer support for holding a semiconductor wafer during a thermal treatment process, said wafer support comprising an elongate shaft having an end and a plurality of flexible fibers supported by the end of the shaft in positions such that the fibers are engageable with a surface of said semiconductor wafer oriented so said surface is generally horizontal, the fibers being made of a material that retains at least some weight-bearing capacity when exposed to a temperature of at least about 900 degrees centigrade, wherein at least some of the fibers are arranged to form a wool body.

7. A method of treating a semiconductor wafer, the method comprising:

supporting the semiconductor wafer with a support so its weight is distributed over a plurality of flexible fibers;

heating the wafer to a temperature of at least about 900 degrees centigrade while the wafer is supported by the fibers; and

maintaining a structural integrity of the support while conducting a minimum amount of heat to and/or from the wafer.

8. A method of treating a semiconductor wafer, the method comprising:

setting the semiconductor wafer on a wafer holder, the wafer holder comprising at last three wafer supports configured for use in the thermal wafer treatment process, each of said supports comprising a plurality of flexible fibers, the setting step comprising: (a) resting the wafer on a first fiber of said plurality of fibers; (b) permitting the first fiber to bend under the weight of the wafer; (c) resting the wafer on another fiber of said plurality; (d) permitting said other fiber to bend under the weight of the wafer; and (e) repeating steps (c) and (d) until the weight of the wafer causes no further bending of the fibers; and

heating the wafer while it is supported by the fibers.

9. A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process, said wafer holder comprising at least three wafer supports configured for use in the thermal wafer treatment process, each wafer support comprising an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage said semiconductor wafer when the wafer rests on the wafer supports;

wherein each wafer support has a tapered cavity for receiving the plurality of flexible fibers.

10. A wafer holder as set forth in claim 9 wherein each cavity tapers from a larger diameter at an upper end of the shaft to a smaller diameter away from the upper end of the shaft.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
NOTICE OF LICENSE AGREEMENT Recorded Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
SECURITY AGREEMENT Recorded Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
SECURITY AGREEMENT Recorded Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2008
From: PITNEY, JOHN A.; TORACK, THOMAS A.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 021536/0801 →