Method of polishing a tungsten carbide surface
View Patent ↗The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing component, and a liquid carrier, and abrading at least a portion of the surface to polish the surface. The invention further provides a method for reconditioning a workpiece comprising tungsten carbide. The invention also provides a cutting tool insert having a highly polished surface.
1. A method of chemically-mechanically polishing a surface of a cutting tool insert comprising tungsten carbide comprising:
(i) contacting the surface comprising tungsten carbide with a chemical-mechanical polishing system comprising:
(a) an oxidizing agent,
(b) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof,
(c) a catalyst, and
(d) a liquid carrier, and
(ii) abrading at least a portion of the surface to polish the surface.
2. The method of claim 1 , wherein the oxidizing agent is selected from the group consisting of bromates, bromites, chlorates, chlorites, hydrogen peroxide, hypochlorites, iodates, monoperoxy sulfate, monoperoxy sulfite, monoperoxyphosphate, monoperoxyhypophosphate, monoperoxypyrophosphate, organo-halo-oxy compounds, periodates, permanganate, peroxyacetic acid, and mixtures thereof.
3. The method of claim 1 , wherein the catalyst comprises ferric ion.
4. The method of claim 1 , wherein the abrasive is selected from the group consisting of alumina, ceria, silica, titania, and zirconia.
5. The method of claim 4 , wherein the abrasive is silica.
6. The method of claim 1 , wherein the polishing system comprises an abrasive wherein the abrasive is suspended in the liquid carrier.
7. The method of claim 1 , wherein the polishing system comprises an abrasive wherein the abrasive is fixed to a polishing pad.
8. The method of claim 1 , wherein the polishing system further comprises one or more components selected from the group consisting of corrosion inhibitors, pH adjustors, film-forming agents, and surfactants.
9. The method of claim 1 , wherein the surface further comprises a binder selected from the group consisting of cobalt, chromium, nickel, titanium, iron, and combinations thereof.
10. The method of claim 9 , wherein the binder is a combination of cobalt and chromium.
11. The method of claim 10 , wherein the binder is cobalt.
12. The method of claim 1 , wherein the surface is polished with an RMS surface roughness of about 50 nm or less.
13. A method for reconditioning a cutting device workpiece comprising tungsten carbide and titanium nitride comprising:
(i) providing the workpiece comprising tungsten carbide and titanium nitride,
(ii) contacting the workpiece with a chemical-mechanical polishing system comprising:
(a) an oxidizing agent,
(b) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof,
(c) a catalyst, and
(d) a liquid carrier, and
(iii) abrading at least a portion of the tungsten carbide and titanium nitride of the workpiece to recondition the workpiece.
14. The method of claim 13 , further comprising a step (iv) of applying at least one surface coating to the workpiece.
15. The method of claim 14 , wherein the at least one surface coating is selected from the group consisting of titanium nitride, aluminum titanium nitride, titanium aluminum nitride, titanium carbonitride, aluminum oxide, and combinations thereof.
16. The method of claim 13 , wherein the workpiece being polished comprises at least one surface coating prior to contacting the workpiece with the chemical-mechanical polishing system.
17. The method of claim 16 , wherein the at least one surface coating is selected from the group consisting of titanium nitride, aluminum titanium nitride, titanium aluminum nitride, titanium carbonitride, aluminum oxide, and combinations thereof.
18. The method of claim 17 , wherein the surface coating is titanium nitride.
19. The method of claim 13 , wherein the oxidizing agent is selected from the group consisting of bromates, bromites, chlorates, chlorites, hydrogen peroxide, hypochlorites, iodates, monoperoxy sulfate, monoperoxy sulfite, monoperoxyphosphate, monoperoxyhypophosphate, monoperoxypyrophosphate, organo-halo-oxy compounds, periodates, permanganate, peroxyacetic acid, and mixtures thereof.
20. The method of claim 13 , wherein the catalyst comprises ferric ion.
21. The method of claim 13 , wherein the abrasive is selected from the group consisting of alumina, ceria, silica, titania, and zirconia.
22. The method of claim 21 , wherein the abrasive is silica.
23. The method of claim 13 , wherein the polishing system comprises an abrasive wherein the abrasive is suspended in the liquid carrier.
24. The method of claim 13 , wherein the polishing system comprises an abrasive fixed to a polishing pad.
25. The method of claim 13 , wherein the polishing system further comprises one or more components selected from the group consisting of corrosion inhibitors, pH adjustors, film-forming agents, and surfactants.
26. The method of claim 13 , wherein the workpiece further comprises a binder selected from the group consisting of cobalt, chromium, nickel, titanium, iron, and combinations thereof.
27. The method of claim 26 , wherein the binder is a combination of cobalt and chromium.
28. The method of claim 27 , wherein the binder is cobalt.