Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die
A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
1. A method of making a semiconductor device, comprising:
providing a metal substrate for supporting the semiconductor device;
connecting solder bumps to the substrate;
mounting a semiconductor die to the substrate using a die attach adhesive, the semiconductor die having a plurality of contact pads formed over a surface of the semiconductor die;
depositing encapsulant over the solder bumps and the semiconductor die;
etching the encapsulant to expose the contact pads of the semiconductor die;
forming a first redistribution layer (RDL) over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps; and
removing the substrate to expose the die attach adhesive and a bottom surface of the solder bumps.
2. The method of claim 1 , wherein removing the substrate includes chemical-mechanical polishing (CMP), wet etching, or plasma etching.
3. The method of claim 1 , wherein the substrate includes a plurality of solder capture dents.
4. The method of claim 1 , wherein the solder bumps are configured in a plurality of staggered rows around the semiconductor die.
5. The method of claim 1 , including forming a second RDL over a back surface of the semiconductor device opposite the first RDL after removing the substrate.
6. The method of claim 1 , wherein depositing encapsulant over the solder bumps and the semiconductor die includes controlling the flow of the encapsulant to expose a top portion of the plurality of solder bumps.
7. The method of claim 1 , wherein the substrate includes a copper (Cu) material.
8. A method of making a semiconductor device, comprising:
providing a substrate for supporting the semiconductor device;
connecting a solder bump to the substrate;
mounting a semiconductor die to the substrate, the semiconductor die having a contact pad formed over a surface of the semiconductor die;
depositing encapsulant over the solder bump and the semiconductor die;
etching the encapsulant to expose the contact pad of the semiconductor die;
forming a first redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the solder bump; and
removing the substrate to expose a bottom surface of the solder bump.
9. The method of claim 8 , wherein removing the substrate includes chemical-mechanical polishing (CMP), wet etching, or plasma etching.
10. The method of claim 8 , wherein the substrate includes a plurality of solder capture dents.
11. The method of claim 8 , wherein the substrate includes a copper (Cu) material.
12. The method of claim 8 , including forming a second RDL over a back surface of the semiconductor device opposite the first RDL after removing the substrate.
13. The method of claim 8 , wherein depositing encapsulant over the solder bump and the semiconductor die includes controlling the flow of the encapsulant to expose a top portion of the solder bump.
14. A method of making a semiconductor device, comprising:
providing a substrate for supporting the semiconductor device;
connecting a conductive bump to the substrate;
mounting a semiconductor die to the substrate;
depositing encapsulant over the conductive bump and the semiconductor die;
removing a portion of the encapsulant to expose a contact pad of the semiconductor die;
forming a redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the conductive bump; and
removing the substrate to expose a bottom surface of the conductive bump.
15. The method of claim 14 , wherein removing the substrate includes chemical-mechanical polishing (CMP), wet etching, or plasma etching.
16. The method of claim 14 , wherein the substrate includes a plurality of solder capture dents.
17. The method of claim 14 , wherein depositing encapsulant over the conductive bump and the semiconductor die includes controlling the flow of the encapsulant to expose a top portion of the conductive bump.
18. The method of claim 14 , wherein the substrate includes a copper (Cu) material.
19. A method of making a semiconductor device, comprising:
providing a substrate for supporting the semiconductor device;
forming a bump over the substrate;
mounting a semiconductor die to the substrate;
depositing an encapsulant over the bump and semiconductor die;
removing a portion of the encapsulant to expose a contact pad of the semiconductor die;
forming a redistribution layer (RDL) over the encapsulant to connect the contact pad of the semiconductor die to the bump; and
removing the substrate to expose a bottom surface of the bump.
20. The method of claim 19 , wherein removing the substrate includes chemical-mechanical polishing (CMP), wet etching, or plasma etching.
21. The method of claim 19 , wherein the substrate includes a plurality of capture dents.
22. The method of claim 19 , wherein depositing encapsulant over the bump and the semiconductor die includes controlling the flow of the encapsulant to expose a top portion of the bump.
23. The method of claim 19 , wherein the substrate includes a copper (Cu) material.