Integrated circuit package system with mounting structure
View Patent ↗An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.
1. An integrated circuit package system comprising:
a mountable structure having a contact pad and an inner pad exposed through a protective layer of the mountable structure; and
an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side and with the linear through channel connected through the protective layer to the inner pad, the integrated circuit device first side and the integrated circuit device second side located along outermost boundaries of the integrated circuit device.
2. The system as claimed in claim 1 wherein the mountable structure includes an insulation layer or a semiconductor die.
3. The system as claimed in claim 1 wherein integrated circuit device includes:
a first integrated circuit; and
a second integrated circuit over the first integrated circuit.
4. The system as claimed in claim 1 further comprising:
a carrier with the mountable structure thereover and connected with the contact pad; and
an encapsulation over the earner and the mountable structure with the linear through channel exposed.
5. The system as claimed in claim 1 further comprising an encapsulation over the mountable structure with the linear through channel exposed with the encapsulation planar with the integrated circuit device first side.
6. The system as claimed in claim 1 wherein:
the contact pad exposed by the integrated circuit device; and
further comprising:
a mounting interconnect between the linear through channel exposed on the integrated circuit device second side and the inner pad.
7. The system as claimed in claim 6 further comprising an underfill around the mounting interconnect.
8. The system as claimed in claim 6 wherein the mountable structure includes the protective layer with the contact pad exposed from the protective layer.
9. The system as claimed in claim 6 wherein the integrated circuit device is over the inner pad.
10. The system as claimed in claim 6 further comprising:
a carrier;
a packaged module over the carrier with the mountable structure over the packaged module and the contact pad connected to the carrier; and
an encapsulation over the carrier, the packaged module, and the mountable structure with the linear through channel exposed; and
a device over the linear through channel.