SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS
A semiconductor module including multiple semiconductor devices prevents a signal that flows through a bonding wire connected to one semiconductor device from acting as noise which affects the other semiconductor devices, thereby improving the operation reliability of the semiconductor module. A second semiconductor device layered on a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire. The bonding wire is provided across the side E 1 of the second semiconductor device. A bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device other than the side F 1 that corresponds to the side E 1 of the second semiconductor device, i.e., across the side F 2 , F 3 , or F 4 of the first semiconductor device.
1 . A semiconductor module comprising:
a wiring substrate including substrate electrodes on one main surface thereof;
a first semiconductor device which is mounted on the wiring substrate, and which includes a logic signal electrode via which a logic signal is input or output;
a second semiconductor device which is mounted on the first semiconductor device, and which includes a current output electrode via which large current is output;
a first bonding wire which electrically connects the logic signal electrode and the corresponding substrate electrode; and
a second bonding wire which electrically connects the current output electrode and the corresponding substrate electrode,
wherein, as viewed from the main surface side of the wiring substrate, the first bonding wire is provided across a side of the first semiconductor device that does not correspond to the side of the second semiconductor device across which the second bonding wire is provided.
2 . A semiconductor module according to claim 1 , wherein the current output electrode is provided along a side of the second semiconductor device across which the second bonding wire is provided.
3 . A semiconductor module according to claim 1 , wherein the first semiconductor device outputs an anti-shake signal used to correct blurring due to shaking applied to an image pickup apparatus,
and wherein the second semiconductor device outputs large current to be supplied to a driving means which drives a lens of the image pickup apparatus according to the anti-shake signal.
4 . A semiconductor module according to claim 2 , wherein the first semiconductor device outputs an anti-shake signal used to correct blurring due to shaking applied to an image pickup apparatus,
and wherein the second semiconductor device outputs large current to be supplied to a driving means which drives a lens of the image pickup apparatus according to the anti-shake signal.
5 . A semiconductor module according to claim 3 , wherein the driving means is a voice coil motor.
6 . A semiconductor module according to claim 4 , wherein the driving means is a voice coil motor.
7 . A semiconductor module according to claim 1 , wherein the logic signal electrode is provided along a side of the first semiconductor device which side does not correspond to the side of the second semiconductor device across which the second bonding wire is provided.
8 . A semiconductor module according to claim 2 , wherein the logic signal electrode is provided along a side of the first semiconductor device which side does not correspond to the side of the second semiconductor device across which the second bonding wire is provided.
9 . A semiconductor module according to claim 3 , wherein the logic signal electrode is provided along a side of the first semiconductor device which side does not correspond to the side of the second semiconductor device across which the second bonding wire is provided.
10 . A semiconductor module according to claim 5 , wherein the logic signal electrode is provided along a side of the first semiconductor device which side does not correspond to the side of the second semiconductor device across which the second bonding wire is provided.
11 . An image pickup apparatus including a semiconductor module according to claim 1 .
12 . An image pickup apparatus including a semiconductor module according to claim 2 .
13 . An image pickup apparatus including a semiconductor module according to claim 3 .
14 . An image pickup apparatus including a semiconductor module according to claim 5 .
15 . An image pickup apparatus including a semiconductor module according to claim 7 .