Integrated circuit packaging system and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.
1. An integrated circuit packaging system comprising:
an integrated circuit, having an active side and a non-active side, with an indent, having a flange and an indent side, in a peripheral region of the active side and an elevated portion at a central region of the active side, the flange along the perimeter of the elevated portion, the integrated circuit includes a terminal pad at the active side; and
a conformal interconnect, having an elevated segment, a sloped segment, and a flange segment, over the indent, the conformal interconnect includes the sloped segment between the flange segment and the elevated segment;
a mounting pad on the active side, the mounting pad and the elevated segment on the elevated portion;
a carrier with the integrated circuit thereover and connected to the flange segment;
a device mounted over the carrier; and
an encapsulation over the integrated circuit and the device with the elevated segment exposed.
2. The system as claimed in claim 1 wherein:
the conformal interconnect having the elevated segment includes the elevated segment over the terminal pad.
3. The system as claimed in claim 1 wherein the integrated circuit includes an integrated circuit edge exposed by the conformal interconnect.
4. The system as claimed in claim 1 wherein:
the device is mounted over the integrated circuit and connected to the carrier; and
the encapsulation includes an opening over the integrated circuit and the device with the device exposed by the opening.