Integrated circuit packaging system and method of manufacture thereof

1. An integrated circuit packaging system comprising:

an integrated circuit, having an active side and a non-active side, with an indent, having a flange and an indent side, from a peripheral region of the non-active side and a channel through the integrated circuit; and

a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent.

2. The integrated circuit packaging system according to claim 1 wherein the integrated circuit includes a terminal pad at the active side and the flange segment below the terminal pad.

3. The integrated circuit packaging system according to claim 1 wherein:

the integrated circuit having the active side includes a terminal pad at the active side; and

the conformal interconnect includes the conformal interconnect connected to the terminal pad.

4. The integrated circuit packaging system according to claim 1 wherein the integrated circuit includes a terminal pad at the active side and the channel to the active side through the terminal pad.

5. The integrated circuit packaging system according to claim 1 further comprising a mounting pad over the non-active side and adjacent to the offset segment.

6. The integrated circuit packaging system according to claim 1 further comprising:

the integrated circuit includes a terminal pad at the active side and the channel between the active side and the non-active side; and

the conformal interconnect includes the sloped segment between the flange segment and the offset segment.

7. The integrated circuit packaging system according to claim 6 further comprising:

a carrier with the integrated circuit thereover;

an encapsulation over the integrated circuit; and wherein:

the flange segment is connected to the carrier.

8. The integrated circuit packaging system according to claim 6 further comprising:

a carrier with the integrated circuit thereover and connected to the flange segment;

a device over the integrated circuit and connected to the carrier; and

an encapsulation over the integrated circuit and the device.

9. The integrated circuit packaging system according to claim 6 further comprising:

a carrier

a device over and connected to the carrier with the integrated circuit over the device and the flange segment connected to the carrier; and

an encapsulation, over the integrated circuit and the device, with the offset segment exposed.

10. The integrated circuit packaging system according to claim 6 further comprising:

a carrier

a first device over and connected to the carrier with the integrated circuit over the first device and the flange segment connected to the carrier;

a second device over the integrated circuit and connected to the carrier; and

an encapsulation, having an opening, over the first device, the, integrated circuit and the second device with the second device exposed by the opening.