Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a lead;

mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad;

forming an exposed terminal interconnect on the connection pad; and

encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

2. The method as claimed in claim 1 further comprising:

mounting a first integrated circuit die above the inner package; and

connecting the first integrated circuit die to the lead or the connection pad with an interconnect.

3. The method as claimed in claim 1 wherein:

providing the lead includes providing a base lead-frame;

mounting the base lead-frame on a coverlay tape;

further comprising:

removing the coverlay tape; and

singulating the base lead-frame from the lead.

4. The method as claimed in claim 1 wherein:

partially encapsulating the exposed terminal interconnect includes exposing a level exposed surface, a bulged exposed surface, or a combination thereof.

5. The method as claimed in claim 1 further comprising:

mounting an external integrated circuit package above the encapsulation; and

connecting the external integrated circuit package to the exposed terminal interconnects with a solder bump, a bond wire or a combination thereof.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a lead;

mounting a dual row inner package or a selectively balled inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad;

forming an exposed terminal interconnect on the connection pad; and

encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation to create a first selectively balled integrated circuit packaging system or a first dual row integrated circuit packaging system.

7. The method as claimed in claim 6 wherein:

mounting the dual row inner package includes mounting a dual row inner package having an inner package die-pad, and the connection pad is a first row connection pad or a second row connection pad.

8. The method as claimed in claim 6 wherein:

mounting the selectively balled inner package includes mounting a selectively balled inner package having a substrate, and the connection pad is a wire-bond connection pad or an exposed terminal interconnect connection pads.

9. The method as claimed in claim 6 further comprising:

mounting a second selectively balled integrated circuit packaging system above the first selectively balled integrated circuit packaging system; and

connecting the exposed terminal interconnect or the lead of the first selectively balled integrated circuit packaging system to an exposed terminal interconnect or a lead of the second selectively balled integrated circuit packaging system.

10. The method as claimed in claim 6 wherein:

connecting the dual row inner package or the selectively balled inner package to the lead with an interconnect.

11. An integrated circuit packaging system comprising:

a lead;

an inner package having a connection pad mounted so that the lead is peripheral to the inner package;

an exposed terminal interconnect formed on the connection pad; and

an encapsulation that encapsulates the inner package, and partially encapsulates the exposed terminal interconnect.

12. The system as claimed in claim 11 further comprising:

a first integrated circuit die mounted above the inner package; and

an interconnect that connects the first integrated circuit die to the lead or the connection pad.

13. The system as claimed in claim 11 further comprising:

an external integrated circuit package mounted above the encapsulation;

a base substrate mounted below the lead; and

an exterior encapsulation that encapsulates the external integrated circuit package and the encapsulation.

14. The system as claimed in claim 11 further comprising:

a level exposed surface, a bulged exposed surface, or a combination thereof exposed from the encapsulation on the exposed terminal interconnect.

15. The system as claimed in claim 11 further comprising:

an external integrated circuit package mounted above the encapsulation; and

a solder bump, a bond wire or a combination thereof that connects the external integrated circuit package to the exposed terminal interconnects.

16. The system as claimed in claim 11 wherein:

the inner package is a dual row inner package or a selectively balled inner package that creates a first selectively balled integrated circuit packaging system or a first dual row integrated circuit packaging system.

17. The system as claimed in claim 16 wherein:

the dual row inner package has an inner package die-pad, and the connection pad is a first row connection pad or a second row connection pad.

18. The system as claimed in claim 16 wherein:

the selectively balled inner package has a substrate, and the connection pad is a wire-bond connection pad or an exposed terminal interconnect connection pads.

19. The system as claimed in claim 16 further comprising:

a second selectively balled integrated circuit packaging system mounted above the first selectively balled integrated circuit packaging system; and

a solder interconnect that connects the exposed terminal interconnect or the lead of the first selectively balled integrated circuit packaging system to an exposed terminal interconnect or a lead of the second selectively balled integrated circuit packaging system.

20. The system as claimed in claim 16 wherein:

the dual row inner package or the selectively balled inner package is connected to the lead with an interconnect.