Protruding post substrate package structure and method

1. A method of forming a protruding post substrate package comprising:

applying a dielectric layer to a carrier;

forming via apertures in the dielectric layer;

creating carrier cavities in the carrier using the dielectric layer as a mask;

lining the carrier cavities with a first metal, the first metal being selectively etchable compared to the carrier;

filling the carrier cavities with a second metal, wherein the first metal and the second metal form protruding posts;

forming a seed layer over a second surface of the dielectric layer, on sidewalls of the via apertures, and on the second metal;

filling the via apertures with a circuit pattern metal to form vias in the via apertures, the vias being electrically connected to the protruding posts, wherein the circuit pattern metal covers the seed layer;

forming a circuit pattern electrically connected to the vias comprising:

applying a resist to the circuit pattern metal;

patterning the resist to expose circuit pattern portions of the circuit pattern metal;

plating a circuit pattern buildup layer on the circuit pattern portions;

removing the resist to expose exposed portions of the circuit pattern metal; and

removing the exposed portions of the circuit pattern metal and underlying portions of the seed layer using the circuit pattern buildup layer as a mask; and

removing the carrier, wherein the protruding posts comprising the first metal protrude outward from a first surface of the dielectric layer.

2. A method of forming a protruding post substrate package comprising:

applying a dielectric layer to a carrier;

forming via apertures in the dielectric layer;

creating carrier cavities in the carrier using the dielectric layer as a mask;

lining the carrier cavities with a first metal, the first metal being selectively etchable compared to the carrier;

filling the carrier cavities with a second metal, wherein the first metal and the second metal form protruding posts;

forming a seed layer over a second surface of the dielectric layer, on sidewalls of the via apertures, and on the second metal;

filling the via apertures with a circuit pattern metal to form vias in the via apertures, the vias being electrically connected to the protruding posts, wherein the circuit pattern metal covers the seed layer;

forming a circuit pattern electrically connected to the vias comprising:

applying a resist to the circuit pattern metal;

patterning the resist to expose exposed portions of the circuit pattern metal; and

removing the exposed portions of the circuit pattern metal and underlying portions of the seed layer to form the circuit pattern; and

removing the carrier, wherein the protruding posts comprising the first metal protrude outward from a first surface of the dielectric layer.

3. The method of claim 2 further comprising: removing the resist.

4. The method of claim 1 further comprising:

applying a buildup dielectric layer to the second surface of the dielectric layer and on the circuit pattern.

5. The method of claim 4 further comprising:

forming via apertures in the buildup dielectric layer to expose lands of the circuit pattern.

6. The method of claim 5 further comprising forming vias in the via apertures of the buildup dielectric layer, the vias in the via apertures of the buildup dielectric layer being electrically connected to the circuit pattern.

7. The method of claim 6 further comprising electrically connecting bond pads of an electronic component to the vias in the via apertures of the buildup dielectric layer.

8. The method of claim 7 further comprising encapsulating the electronic component in an encapsulant.

9. A method of forming a protruding post substrate package comprising:

applying a dielectric layer to a carrier;

forming via apertures in the dielectric layer;

creating carrier cavities in the carrier using the dielectric layer as a mask;

lining the carrier cavities with a first metal, the first metal being selectively etchable compared to the carrier;

filling the carrier cavities with a second metal, wherein the first metal and the second metal form protruding posts;

forming a seed layer over a second surface of the dielectric layer, on sidewalls of the via apertures, and on the second metal;

filling the via apertures with a circuit pattern metal to form vias in the via apertures, the vias being electrically connected to the protruding posts;

forming a circuit pattern electrically connected to the vias;

applying a buildup dielectric layer to the second surface of the dielectric layer and on the circuit pattern;

forming via apertures in the buildup dielectric layer to expose lands of the circuit pattern;

forming vias in the via apertures of the buildup dielectric layer, the vias in the via apertures of the buildup dielectric layer being electrically connected to the circuit pattern;

removing the carrier, wherein the protruding posts comprising the first metal protrude outward from a first surface of the dielectric layer; and

electrically connecting bond pads of an electronic component to the protruding posts.

10. The method of claim 9 further comprising encapsulating the electronic component in an encapsulant.

11. The method of claim 10 further comprising forming interconnection balls on the vias in the via apertures of the buildup dielectric layer.

12. A method of forming a protruding post substrate package comprising:

applying a dielectric layer to a carrier;

forming via apertures in the dielectric layer;

creating carrier cavities in the carrier using the dielectric layer as a mask;

lining the carrier cavities with a first metal to form protruding posts in the carrier, the first metal being selectively etchable compared to the carrier;

forming a circuit pattern coupled to the protruding posts;

mounting a circuit pattern buildup structure to the dielectric layer and the circuit pattern by an adhesive,

removing the carrier, wherein the protruding posts protrude outward from the dielectric layer;

forming blind via apertures extending through the dielectric layer, through the circuit pattern, through the adhesive to expose a first circuit pattern of the circuit pattern buildup structure; and

forming blind vias in the blind via apertures, the blind vias electrically connecting the circuit pattern with the first circuit pattern.