Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit

1. An integrated circuit comprising:

a plurality of separate continuous first conductive lines, wherein the plurality of first conductive lines are arranged within a first metallization level and extend along a first direction;

a plurality of separate continuous second conductive lines, wherein the plurality of second conductive lines are arranged in a second metallization level over the first metallization level and extend in the first direction;

a plurality of contact structures, each of the plurality of contact structures being in electrical contact with an associated one of the plurality of first and one of the plurality of second conductive lines and being arranged along a line that extends into a second direction,

wherein the plurality of second conductive lines are arranged over the contact structures, and wherein a pitch of adjacent contact structures is equal to a pitch of adjacent second conductive lines and wherein a distance between adjacent contact structures is smaller than 100 nm.

2. The integrated circuit according to claim 1 , wherein the second direction is perpendicular to the first direction.

3. The integrated circuit according to claim 1 , wherein the plurality of first conductive lines comprise a first material and the plurality of second conductive lines comprise a second material being different from the first material.

4. The integrated circuit according to claim 1 , wherein the plurality of first conductive lines comprise a first material and the plurality of second conductive lines comprise the first material.

5. The integrated circuit according to claim 1 , wherein the distance between neighboring contact structures is smaller than 80 nm.

6. The integrated circuit according to claim 5 , wherein the distance between neighboring contact structures is smaller than 50 nm.

7. An integrated circuit comprising:

a plurality of separate first conductive lines comprising a first conductive material, wherein the plurality of first conductive lines are arranged within a first metallization level;

a plurality of separate second conductive lines, wherein the plurality of second conductive lines are arranged in a second metallization level over the first metallization level;

a plurality of contact structures, each of the plurality of contact structures being in electrical contact with an associated one of the first and an associated one of the second conductive lines, wherein the plurality of second conductive lines are arranged over the plurality of contact structures, and wherein each of the plurality of contact structures comprises a second conductive material, the second conductive material being in contact with the plurality of second conductive lines, a boundary between the plurality of contact structures and an intermediate layer forming a horizontal line without vertical components, the intermediate layer being disposed between the plurality of separate first conductive lines and the plurality of contact structures.

8. The integrated circuit of claim 7 , wherein the second conductive material is the same as the first conductive material.

9. The integrated circuit of claim 7 , wherein a diameter of an upper portion of the plurality of contact structures is smaller than a width of the first conductive lines.

10. The integrated circuit of claim 7 , wherein a pitch of adjacent contact structures is equal to a pitch of adjacent first conductive lines.

11. The integrated circuit of claim 7 , wherein a distance between adjacent contact structures is smaller than 100 nm.