Chemical-mechanical polishing composition and method for using the same
View Patent ↗The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
1. A method of polishing a noble metal-containing substrate comprising the steps of:
(a) providing a substrate, wherein the substrate comprises a noble metal selected from the group consisting of platinum, iridium, ruthenium, rhodium, palladium, silver, osmium, gold, and combinations thereof
(b) providing a chemical-mechanical polishing composition comprising:
(i) an abrasive comprising α-alumina,
(ii) about 0.05 to about 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and
(iii) a liquid carrier comprising water,
(c) applying the chemical-mechanical polishing composition to at least a portion of the substrate, and
(d) abrading at least a portion of the noble metal of the substrate with the polishing composition to polish the substrate.
2. The method of claim 1 , wherein the ions of the metal are present in the chemical-mechanical polishing composition in an amount of about 0.05 to about 10 mmol/kg.
3. The method of claim 2 , wherein the ions of the metal are present in the chemical-mechanical polishing composition in an amount of about 0.05 to about 5 mmol/kg.
4. The method of claim 1 , wherein the substrate comprises platinum, and at least a portion of the platinum is abraded with the polishing composition to polish the substrate.
5. The method of claim 1 , wherein the abrasive further comprises fumed alumina.
6. The method of claim 5 , wherein the abrasive comprises about 10 wt. % or more α-alumina.
7. The method of claim 1 , wherein the abrasive is present in the polishing composition in an amount of about 0.1 to about 10 wt. % based on the total weight of the polishing composition.
8. The method of claim 7 , wherein the abrasive is present in the polishing composition in an amount of about 1 to about 5 wt. % based on the total weight of the polishing composition.
9. The method of claim 1 , wherein the polishing composition has a pH of about 1 to about 7.
10. The method of claim 9 , wherein the polishing composition has a pH of about 2 to about 5.
11. A method of polishing a noble metal-containing substrate comprising the steps of:
(a) providing a substrate, wherein the substrate comprises a noble metal selected from the group consisting of platinum, iridium, ruthenium, rhodium, palladium, silver, osmium, gold, and combinations thereof,
(b) providing a chemical-mechanical polishing composition comprising:
(i) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof,
(ii) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and
(iii) a liquid carrier comprising water,
(c) applying the chemical-mechanical polishing composition to at least a portion of the substrate, and
(d) abrading at least a portion of the noble metal of the substrate with the polishing composition to polish the substrate.
12. The method of claim 11 , wherein the substrate comprises platinum, and at least a portion of the platinum is abraded with the polishing composition to polish the substrate.
13. The method of claim 11 , wherein the abrasive further comprises fumed alumina.
14. The method of claim 13 , wherein the abrasive comprises about 10 wt. % or more α-alumina.
15. The method of claim 11 , wherein the abrasive is present in the polishing composition in an amount of about 0.1 to about 10 wt. % based on the total weight of the polishing composition.
16. The method of claim 15 , wherein the abrasive is present in the polishing composition in an amount of about 1 to about 5 wt. % based on the total weight of the polishing composition.
17. The method of claim 11 , wherein the polishing composition has a pH of about 1 to about 7.
18. The method of claim 17 , wherein the polishing composition has a pH of about 2 to about 5.