Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability
View Patent ↗A semiconductor device has a first conductive layer formed over a substrate. A first insulating layer is formed over the first conductive layer. A second conductive layer is formed over first insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. An under bump metallization layer (UBM) is formed over the third insulating layer and second conductive layer. A UBM build-up structure is formed over the UBM. The UBM build-up structure has a sloped sidewall and is confined within a footprint of the UBM. The UBM build-up structure extends above the UBM to a height of 2-20 micrometers. The UBM build-up structure is formed in sections occupying less than an area of the UBM. A solder bump is formed over the UBM and UBM build-up structure. The sections of the UBM build-up structure provide exits for flux vapor escape.
1. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first insulating layer over the substrate;
forming an under bump metallization layer (UBM) over the first insulating layer;
forming a build-up structure over the UBM, the build-up structure being confined within a footprint of the UBM;
forming a bump over the UBM and build-up structure;
forming the build-up structure in sections occupying less than an area of the UBM; and
forming exits between the sections of the build-up structure for flux vapor escape.
2. The method of claim 1 , wherein the build-up structure extends above the UBM to a height of 2-20 micrometers.
3. The method of claim 1 , wherein the build-up structure is plated with TiW/Cu, Ti/Cu, Ti/NiV/Cu, or TiW/NiV/Cu.
4. The method of claim 1 , further including:
forming a first conductive layer over the substrate;
forming a second insulating layer over the first conductive layer; and
forming a second conductive layer over second insulating layer and first conductive layer, the second conductive layer being electrically connected to the UBM.
5. The method of claim 4 , wherein the second conductive layer is a redistribution layer to extend interconnectivity of the second conductive layer.
6. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first insulating layer over the substrate;
forming a first conductive layer over the first insulating layer;
forming an under bump metallization (UBM) build-up structure over the first conductive layer;
forming a bump over the first conductive layer and UBM build-up structure; and
forming the UBM build-up structure in sections with exits for flux vapor escape.
7. The method of claim 6 , wherein the UBM build-up structure extends above the first conductive layer to a height of 2-20 micrometers.
8. The method of claim 6 , wherein the UBM build-up structure is plated with TiW/Cu, Ti/Cu, Ti/NiV/Cu, or TiW/NiV/Cu.
9. The method of claim 6 , further including:
forming a second conductive layer over the substrate;
forming a second insulating layer over the first conductive layer; and
forming the first conductive layer over second insulating layer and second conductive layer, the second conductive layer being electrically connected to the first conductive layer.
10. The method of claim 9 , wherein the first conductive layer is a redistribution layer with adhesive, barrier, and wetting layers to extend interconnectivity of the second conductive layer.
11. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first insulating layer over the substrate;
forming a first conductive layer over the first insulating layer;
forming an under bump metallization (UBM) build-up structure over the first conductive layer;
forming an interconnect structure over the first conductive layer and UBM build-up structure;
forming a second conductive layer over the substrate;
forming a second insulating layer over the first conductive layer; and
forming the first conductive layer over second insulating layer and second conductive layer, the second conductive layer being electrically connected to the first conductive layer.
12. The method of claim 11 , further including forming the UBM build-up structure in sections with exits for flux vapor escape.
13. The method of claim 11 , wherein the UBM build-up structure extends above the first conductive layer to a height of 2-20 micrometers.
14. The method of claim 11 , further including forming a connection line between edge islands to protect a via opening edge of the second insulating layer on the first conductive layer.
15. The method of claim 11 , wherein the first conductive layer is a redistribution layer to extend interconnectivity of the second conductive layer.
16. A semiconductor device, comprising:
a substrate;
a first insulating layer formed over the substrate;
a first conductive layer formed over the first insulating layer;
an under bump metallization (UBM) build-up structure formed over the first conductive layer; and
an interconnect structure formed over the first conductive layer and UBM build-up structure, wherein the UBM build-up structure is formed in sections with exits for flux vapor escape.
17. The semiconductor device of claim 16 , wherein the UBM build-up structure has a sloped sidewall.
18. The semiconductor device of claim 16 , wherein the interconnect structure includes a bump.
19. The semiconductor device of claim 16 , further including:
a second conductive layer formed over the substrate; and
a second insulating layer formed over the first conductive layer, the first conductive layer being formed over second insulating layer and second conductive layer.
20. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first insulating layer over the substrate;
forming a first conductive layer over the first insulating layer;
forming an under bump metallization (UBM) build-up structure in sections over the first conductive layer with an exit port between the sections; and
forming an interconnect structure over the first conductive layer and UBM build-up structure.
21. The method of claim 20 , wherein the UBM build-up structure extends above the first conductive layer to a height of 2-20 micrometers.
22. The method of claim 20 , further including:
forming a second conductive layer over the substrate;
forming a second insulating layer over the first conductive layer; and
forming the first conductive layer over second insulating layer and second conductive layer, the second conductive layer being electrically connected to the first conductive layer.
23. The method of claim 22 , further including forming a connection line between edge islands to protect a via opening edge of the second insulating layer on the first conductive layer.
24. The method of claim 22 , wherein the first conductive layer is a redistribution layer to extend interconnectivity of the second conductive layer.