Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate having a plurality of substrate-interconnects;

mounting a plurality of internal interconnects to and over the plurality of substrate-interconnects;

mounting an integrated circuit above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects;

mounting an interposer having an integral-interposer-structure over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, wherein mounting the interposer includes mounting an integral-conductive-shield having a hole;

embedding a die in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure; and

forming an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit.

2. The method as claimed in claim 1 wherein mounting the plurality of internal interconnects includes mounting each of the plurality of internal interconnects having a stand-off-height from the integrated circuit to the integral-conductive-shield.

3. The method as claimed in claim 1 wherein mounting the interposer further includes forming a grounding path from the integral-conductive shield through the plurality of internal interconnects, with the grounding path extending over and across the integrated circuit.

4. The method as claimed in claim 1 further comprising:

mounting an external interconnect to and under each of the plurality of substrate-interconnects.

5. The method as claimed in claim 1 wherein mounting the integrated circuit includes mounting a flip-chip.

6. The method as claimed in claim 1 further comprising

mounting a passive component between the substrate and the integral-interposer-structure.

7. An integrated circuit packaging system comprising:

a substrate having a plurality of substrate-interconnects;

a plurality of internal interconnects mounted to and over the plurality of substrate-interconnects;

an integrated circuit mounted above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects;

an interposer having an integral-interposer-structure mounted over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, the integral-interposer-structure having a die embedded in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure, wherein the integral-interposer-structure is an integral-conductive-shield having a hole; and

an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit.

8. The system as claimed in claim 7 wherein each of the plurality of internal interconnects includes a stand-off-height from the integrated circuit to the integral-conductive-shield.

9. The system as claimed in claim 7 further comprising a ground path from the integral-conductive shield through the plurality of internal interconnects with the ground path extending over and across the integrated circuit.

10. The system as claimed in claim 7 further comprising:

an external interconnect mounted to each of the plurality of substrate-interconnects.

11. The system as claimed in claim 7 wherein the integrated circuit is a flip-chip.

12. The system as claimed in claim 7 further comprising a passive component mounted above the substrate and under the integral-interposer-structure.