Three-dimensional transistor with double channel configuration
View Patent ↗A three-dimensional double channel transistor configuration is provided in which a second channel region may be embedded into the body region of the transistor, thereby providing a three-state behavior, which may therefore increase functionality of conventional three-dimensional transistor architectures. The double channel three-dimensional transistors may be used for forming a static RAM cell with a reduced number of transistors, while also providing scalability by taking advantage of the enhanced controllability of FinFETS and nano pipe transistor architectures.
1. A field effect transistor, comprising:
a drain region and a source region having a first conductivity type;
a body region formed at least between said drain and source regions, said body region having a second conductivity type other than said first conductivity type, said body region comprising at least two non-coplanar surface areas;
a gate insulation material formed on said at least two non-coplanar surface areas;
a gate electrode formed on said gate insulation material so as to define a first channel region in said body region at least adjacent to said two non-coplanar surface areas; and
a second channel region at least partially embedded in said body region and having said first conductivity type.
2. The field effect transistor of claim 1 , wherein said channel region is separated from said drain and source regions by material of said body region having said first conductivity type.
3. The field effect transistor of claim 1 , further comprising a body contact connecting to said body region.
4. The field effect transistor of claim 3 , wherein said body contact is separated from said second channel region by material of said body region that has said first conductivity type.
5. The field effect transistor of claim 1 , wherein said body region comprises at least one further surface area that is non-coplanar to said at least two non-coplanar surface areas and wherein said gate insulation material is formed on said at least one further surface area.
6. The field effect transistor of claim 1 , wherein said body region comprises a bottom surface formed on a dielectric layer having a thickness that is greater than a thickness of said gate insulation material.
7. The field effect transistor of claim 6 , wherein said drain and source regions are formed on said dielectric layer.
8. The field effect transistor of claim 1 , wherein said body region is formed on a semiconductor substrate material.
9. The field effect transistor of claim 8 , wherein said drain and source regions are formed on said semiconductor substrate material.
10. The field effect transistor of claim 1 , wherein said body region is contained in a semiconductor fin having two sidewall surface areas as said at least two surface areas and wherein a width of said fin is approximately 30 nm or less.
11. The field effect transistor of claim 10 , wherein a height of said fin is approximately 50 nm or less.
12. The field effect transistor of claim 10 , further comprising a plurality of fins, each of which containing a respective one of said second channel region.
13. A field effect transistor, comprising:
a drain region and a source region having a first conductivity type;
a tube-shaped body region formed between said drain and source regions, said body region having a second conductivity type other than said first conductivity type;
a gate insulation material formed on a surface area of said tube-shaped body region;
a gate electrode formed on said gate insulation material; and
a second channel region formed in said body region and having said first conductivity type.
14. The field effect transistor of claim 13 , wherein said second channel region is separated from said drain and source regions by material of said body region having said first conductivity type.
15. The field effect transistor of claim 13 , further comprising a body contact connecting to said body region.
16. The field effect transistor of claim 15 , wherein said body contact is separated from said second channel region by material of said body region that has said first conductivity type.
17. The field effect transistor of claim 13 , wherein said gate electrode substantially completely encloses said body region along a circumferential direction.
18. A memory cell, comprising:
at least one three-dimensional field effect transistor, said three-dimensional field effect transistor comprising a body region containing a first area having a first conductivity type and a second area having a second conductivity type opposite to said first conductivity type, said three-dimensional field effect transistor further comprising a body contact connected to said first area.
19. The memory cell of claim 18 , wherein said three-dimensional field effect transistor comprises a fin accommodating said body region.
20. The memory cell of claim 18 , wherein said three-dimensional field effect transistor comprises a tube-shaped semiconductor element that comprises said body region.
21. The memory cell of claim 18 , wherein said memory cell is a static RAM cell.
22. The memory cell of claim 21 , wherein said memory cell comprises less than six transistors.
23. The memory cell of claim 22 , wherein said memory cell is formed of three transistors.