Wire bonder for improved bondability of a conductive wire and method therefor
View Patent ↗A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.
1. A wire bonder comprising:
a capillary through which a wire passes,
a discharge tip positioned near a bottom section of the capillary and providing a flame to a distal end of the wire; and
a gas diffuser positioned beside the capillary to diffuse a heated gas to the distal end of the wire, wherein the gas diffuser comprises:
a body having an open space formed in an interior section and running a length of the body;
an inlet port formed in the body and in flow communication with the open space;
an outlet port formed in the body and in flow communication with the open space;
a heater inserted into the open space;
a gas supply connected to the inlet port; and
a helical groove formed along an inner diameter surface of the open space in the body, the helical groove extending approximately from the inlet port to the outlet port;
wherein the heater is inserted into the open space to form a gap between the heater and the helical groove, the heated gas flowing downwardly along the helical groove.
2. The wire bonder of claim 1 , further comprising a power supply coupled to the heater.
3. The wire bonder of claim 1 , wherein the gas diffuser provides the heated gas at a temperature of approximately 25 to 300° C.
4. The wire bonder of claim 1 , wherein the heated gas is one of: nitrogen, hydrogen, air and mixtures thereof.
5. The wire bonder of claim 1 , wherein the wire is made of a conductive material selected from one of: copper, gold and aluminum.
6. The wire bonder of claim 1 , further comprising a wire heater positioned above the capillary to heat the wire, wherein the wire runs through the wire heater to enable heating of sections of the wire that pass through the wire heater.
7. The wire bonder of claim 6 , wherein the heater is a thermoelectric element.
8. The wire bonder of claim 6 , further comprising a power supply unit coupled to the heater.
9. The wire bonder of claim 5 , wherein the heater warms the wire to approximately 25 to 300° C.
10. A wire bonder comprising
a capillary through which a conductive wire passes;
a wire heater positioned above the capillary to heat the conductive wire;
a discharge tip positioned near a bottom section of the capillary and providing a flame to a distal end of the conductive wire; and
a gas diffuser positioned beside the capillary to diffuse a heated gas to the distal end of the wire, wherein the gas diffuser comprises:
a hollow body having an inlet port at a first end of the hollow body and an outlet port at a second end of the hollow body;
a heater inserted into an open space within the hollow body;
a gas supply connected to the inlet port; and
a helical groove formed along an inner diameter surface of the open space in the hollow body, the helical groove extending approximately from the inlet port to the outlet port;
wherein the heater is inserted into the open space to form a gap between the heater and the helical groove, the heated gas flowing downwardly along the helical groove.
11. The wire bonder of claim 10 , wherein the wire heater is a thermoelectric element.
12. The wire bonder of claim 10 , wherein the wire heater heats the conductive wire to a temperature of approximately 25 to 300° C. to the conductive wire.
13. A wire bonder comprising
a capillary through which a conductive wire passes;
means positioned above the capillary for heating the conductive wire;
means positioned near a bottom section of the capillary for providing a flame to a distal end of the wire; and
means positioned beside the capillary for diffusing a heated gas to the distal end of the wire, wherein the means for diffusing a heated gas comprises:
a hollow body having and inlet port and an outlet port;
a heater inserted into an open space within the hollow body;
a gas supply connected to the inlet port; and
a helical groove formed along an inner diameter surface of the open space in the hollow body, the helical groove extending approximately from the inlet port to the outlet port;
wherein the heater is inserted into the open space to form a gap between the heater and the helical groove, the heated gas flowing downwardly along the helical groove.
14. The wire bonder of claim 13 , wherein the heated gas is one of: nitrogen, hydrogen, air and mixtures thereof.
15. The wire bonder of claim 13 , wherein the means for heating the conductive wire heats the conductive wire to a temperature of approximately 25 to 300° C.