Integrated circuit packaging system with bumps and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.
1. An integrated circuit packaging system comprising:
a terminal body with a substantially spherical shape, the terminal body having a terminal layer on a terminal core, the terminal core formed from a non-conductive material;
a device adjacent the terminal body, a device mount side of the device below a top portion of the terminal body;
a device connector attached to the device and the top portion of the terminal body; and
an encapsulant over the device connector, the device, and the top portion of the terminal body, a bottom portion of the terminal body partially exposed from the encapsulant.
2. The system as claimed in claim 1 wherein the terminal layer covers the terminal core.
3. The system as claimed in claim 1 wherein the terminal body includes a coating layer over the terminal body.
4. The system as claimed in claim 1 wherein the terminal body includes a flat side of the terminal body.
5. The system as claimed in claim 1 wherein the terminal body includes the terminal body having characteristics of force fitting.
6. The system as claimed in claim 1 wherein:
the terminal body has an interconnection portion and a bump portion;
the device is next to the terminal body, the device mount side of the device partially below the interconnection portion;
the device connector is attached to the device and the interconnection portion; and
the encapsulant is over the device connector, the device, and the interconnection portion, the bump portion substantially exposed from the encapsulant.
7. The system as claimed in claim 6 wherein:
the device connector is attached to the terminal layer of the interconnection portion of the terminal body.
8. The system as claimed in claim 6 wherein:
the terminal body includes a coating layer over the interconnection portion; and
the device connector is attached to the coating layer.
9. The system as claimed in claim 6 wherein at least twenty-five percent of the terminal body is within the encapsulant.
10. The system as claimed in claim 6 wherein the at least twenty-five percent of the terminal body is substantially exposed from the encapsulant.