Nanopillar decoupling capacitor
View Patent ↗Techniques for incorporating nanotechnology into decoupling capacitor designs are provided. In one aspect, a decoupling capacitor is provided. The decoupling capacitor comprises a first electrode; an intermediate layer adjacent to the first electrode having a plurality of nanochannels therein; a conformal dielectric layer formed over the intermediate layer and lining the nanochannels; and a second electrode at least a portion of which is formed from an array of nanopillars that fill the nanochannels in the intermediate layer. Methods for fabricating the decoupling capacitor are also provided, as are semiconductor devices incorporating the decoupling capacitor design.
1. A method for fabricating a decoupling capacitor, comprising the steps of:
forming a first electrode;
forming an intermediate layer adjacent to the first electrode;
forming a copolymer layer over the intermediate layer;
forming nanopores in the copolymer layer;
etching through the nanopores in the copolymer layer to form a plurality of nanochannels in the intermediate layer;
removing the copolymer layer;
depositing a conformal dielectric layer over the intermediate layer and lining the nanochannels; and
forming a second electrode at least a portion of which comprises an array of nanopillars that fill the nanochannels in the intermediate layer.
2. The method of claim 1 , further comprising the step of:
implanting ions into the intermediate layer.
3. The method of claim 2 , wherein the ions implanted into the intermediate layer comprise boron ions.
4. The method of claim 1 , wherein the copolymer layer comprises a diblock copolymer.
5. The method of claim 4 , wherein the diblock copolymer is a random copolymer of polystyrene and poly(methyl methacrylate) or a polystyrene-block-poly(methyl methacrylate) copolymer.
6. The method of claim 1 , wherein the copolymer layer is spin-coated onto the intermediate layer.
7. The method of claim 1 , wherein the step of forming nanopores in the copolymer layer, further comprises the step of:
annealing the copolymer layer at a temperature of from about 150° C. to about 180° C. for a duration of about 48 hours.