Integrated circuit packaging system with circuitry stacking and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a lead to include a first tip at one end, a second tip on the end opposite from the first tip with a connect area between each end located above the first tip, and a first tier section or a second tier section located between the connect area and the second tip; connecting a bottom component assembly to the first tier section or the second tier section; connecting a top component assembly over the connect area; and applying an encapsulant over and under the connect area with the first tip exposed.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a lead to include a first tip at one end, a second tip on an end opposite from the first tip with a connect area between each end located above the first tip, and a first tier section or a second tier section, located between the connect area and the second tip;
connecting a bottom component assembly to the first tier section or the second tier section;
connecting a top component assembly over the connect area, the top component assembly having a laminated interposer with a contact; and
applying an encapsulant over and under the connect area with the first tip exposed.
2. The method as claimed in claim 1 wherein:
connecting the top component assembly, having a known good unit with a contact next to a top die paddle, over the connect area; and
further comprising:
mounting a bottom die paddle below the bottom component assembly.
3. The method as claimed in claim 1 wherein:
connecting the bottom component assembly, having a known good package, to the second tier section;
connecting the top component assembly, having a device, over the connect area; and
further comprising:
mounting a stack device over the bottom component assembly.
4. The method as claimed in claim 1 further comprising:
connecting a central device to the first tier section; and
wherein:
connecting the top component assembly over the central device, over the connect area, and physically isolated from the lead.
5. A method of manufacture of an integrated circuit packaging system comprising:
forming a lead with a first surface and a second surface to include a first tip at one end, a second tip on an end opposite from the first tip with a connect area between each end located above the first tip and above or next to the second tip, and a first tier section or a second tier section below the first tier section, located between the connect area and the second tip with the first tier section closest to the connect area;
connecting a bottom component assembly to the first surface of the first tier section or the second tier section;
connecting a top component assembly over the first surface of the connect area, the top component assembly having a laminated interposer with a contact exposed adjacent a contact surface; and
applying an encapsulant over and under the connect area with the first tip, the contact, and the contact surface adjacent the contact, and portions of the first surface and the second surface of the connect area exposed.
6. The method as claimed in claim 5 wherein:
connecting the top component assembly, having a known good unit with a contact next to a top die paddle exposed adjacent a contact surface, over the connect area;
applying the encapsulant with the contact next to the top die paddle, the top die paddle, and the contact surface adjacent the contact exposed; and
further comprising:
mounting a bottom die paddle having a side exposed of the encapsulant below the bottom component assembly.
7. The method as claimed in claim 5 wherein:
connecting the bottom component assembly, having a known good package, to the first surface of the second tier section;
connecting the top component assembly, having a device, over the first surface of the connect area; and
further comprising:
mounting a stack device between the top component assembly and the bottom component assembly.
8. The method as claimed in claim 5 further comprising:
connecting a central device to the first surface of the first tier section; and
wherein:
connecting the top component assembly over the central device with the top component assembly physically isolated from the connect area of the lead.
9. An integrated circuit packaging system comprising:
a lead formed to include a first tip at one end, a second tip on an end opposite from the first tip with a connect area between each end located above the first tip, and a first tier section or a second tier section, located between the connect area and the second tip;
a bottom component assembly connected to the first tier section or the second tier section;
a top component assembly connected over the connect area, the top component assembly having a laminated interposer with a contact; and
an encapsulant applied over and under the connect area with the first tip exposed.
10. The system as claimed in claim 9 wherein:
the top component assembly, having a known good unit with a contact next to a top die paddle, connected over the connect area; and
further comprising:
a bottom die paddle mounted below the bottom component assembly.
11. The system as claimed in claim 9 wherein:
the bottom component assembly, having a known good package, connected to the second tier section;
the top component assembly, having a device, connected over the connect area; and
further comprising:
a stack device mounted the bottom component assembly.
12. The system as claimed in claim 9 further comprising:
a central device connected to the first tier section; and
wherein:
the top component assembly connected over the central device, over the connect area, and physically isolated from the lead.
13. The system as claimed in claim 9 wherein:
the lead with a first surface and a second surface formed to include the first tip at one end, the second tip on the end opposite from the first tip with the connect area between each end located above the first tip and above or next to the second tip, and the first tier section or the second tier section below the first tier section located between the connect area and the second tip with the first tier section closest to the connect area;
the bottom component assembly connected to the first surface of the first tier section or the second tier section;
the top component assembly connected over first surface of the connect area; and
the encapsulant applied over and under the connect area with the first tip and portions of the first surface and the second surface of the connect area exposed.
14. The system as claimed in claim 13 wherein:
the top component assembly, having a laminated interposer with a contact exposed adjacent a contact surface, connected over the connect area; and
the encapsulant applied over and under the connect area with the first tip, the contact, and the contact surface adjacent the contact.
15. The system as claimed in claim 13 wherein:
the top component assembly, having a known good unit with a contact next to a top die paddle exposed adjacent a contact surface, connected over the connect area;
the encapsulant applied with the contact next to the top die paddle, the top die paddle, and the contact surface adjacent the contact exposed; and
further comprising:
a bottom die paddle having a side exposed of the encapsulant mounted below the bottom component assembly.
16. The system as claimed in claim 13 wherein:
the bottom component assembly, having a known good package, connected to the first surface of the second tier section;
the top component assembly, having a device, connected over the first surface of the connect area; and
further comprising:
a stack device mounted between the top component assembly and the bottom component assembly.
17. The system as claimed in claim 13 further comprising:
a central device connected to the first surface of the first tier section; and
wherein:
the top component assembly connected over the central device with the top component assembly physically isolated from the connect area of the lead.