Methods of forming layers of semiconductor material having reduced lattice strain, semiconductor structures, devices and engineered substrates including same
View Patent ↗Methods of fabricating semiconductor devices or structures include forming structures of a semiconductor material overlying a layer of a compliant material, subsequently changing the viscosity of the compliant material to relax the semiconductor material structures, and utilizing the relaxed semiconductor material structures as a seed layer in forming a continuous layer of relaxed semiconductor material. In some embodiments, the layer of semiconductor material may comprise a III-V type semiconductor material, such as, for example, indium gallium nitride. Novel intermediate structures are formed during such methods. Engineered substrates include a continuous layer of semiconductor material having a relaxed lattice structure.
1. A method of fabricating a semiconductor structure or device, comprising:
forming a plurality of openings extending through a layer of semiconductor material and at least partially through a layer of compliant material; and
reflowing the layer of compliant material to relax the layer of semiconductor material.
2. The method of claim 1 , further comprising:
depositing another semiconductor material over the layer of semiconductor material;
removing an exposed region of the layer of compliant material to form another plurality of openings therein; and
reflowing the layer of compliant material.
3. The method of claim 2 , wherein depositing another semiconductor material over the layer of semiconductor material comprises depositing the another layer of semiconductor material at a temperature sufficient to alter a viscosity of the layer of compliant material.
4. The method of claim 1 , wherein forming a plurality of openings extending through a layer of semiconductor material and at least partially through a layer of compliant material comprises forming at least one opening of the plurality of openings to extend into the layer of compliant material a distance from about 10% to about 95% of a thickness of the layer of compliant material.
5. The method of claim 1 , further comprising selecting the layer of semiconductor material to comprise a III-V nitride material.
6. The method of claim 1 , wherein reflowing the layer of compliant material to relax the layer of semiconductor material comprises heating the layer of compliant material to a temperature above a glass transition temperature thereof.
7. The method of claim 1 , wherein reflowing the layer of compliant material to relax the layer of semiconductor material comprises heating a layer of borophosphosilicate glass to a temperature of about six hundred degrees Celsius (600° C.).
8. The method of claim 1 , wherein reflowing the layer of compliant material to relax the layer of semiconductor material comprises growing another layer of semiconductor material at a temperature sufficient to alter the viscosity of the layer of compliant material.
9. A method of fabricating a semiconductor structure or device, comprising:
removing a portion of each of a layer of semiconductor material and a layer of compliant material overlying a substrate to form a plurality of openings;
heating the layer of compliant material to alter a viscosity thereof;
depositing another semiconductor material over the layer of semiconductor material; and
removing another portion of the layer of compliant material.
10. The method of claim 9 , wherein removing a portion of each of a layer of semiconductor material and a layer of compliant material overlying a substrate to form a plurality of openings comprises forming the plurality of openings to extend through the layer of semiconductor material and only partially into the layer of compliant material.
11. The method of claim 9 , further comprising selecting the layer of semiconductor material and the another semiconductor material to comprise a III-V type semiconductor material.
12. The method of claim 11 , further comprising selecting the layer of semiconductor material and the another semiconductor material to comprise indium gallium nitride.
13. The method of claim 9 , wherein heating the layer of compliant material to alter a viscosity thereof occurs simultaneously with depositing the another semiconductor material over the layer of semiconductor material.
14. The method of claim 9 , wherein heating the layer of compliant material to alter a viscosity thereof comprises reflowing a layer of compliant material comprising at least one of an oxide, a phosphosilicate glass (PSG), a borosilicate glass (BSG), a borophosphosilicate glass (BPSG), a polyimide, a doped or undoped quasi-inorganic siloxane spin-on-glass (SOG), an inorganic spin-on-glass, and a doped or undoped silicate.
15. The method of claim 9 , further comprising heating the layer of compliant material to alter a viscosity thereof after removing another portion of the layer of compliant material.
16. A method of fabricating a semiconductor structure or device, comprising:
providing a layer of semiconductor material overlying a layer of compliant material on a substrate;
forming a plurality of openings extending through a layer of semiconductor material and partially through a layer of compliant material;
altering a viscosity of the layer of compliant material to relax the layer of semiconductor material; and
growing another semiconductor material over the relaxed portions of the layer of semiconductor material.
17. The method of claim 16 , wherein forming a plurality of openings extending through a layer of semiconductor material and partially through a layer of compliant material comprises forming a plurality of openings extending through a layer of indium gallium nitride and partially through a layer of borophosphosilicate glass.
18. The method of claim 16 , wherein altering a viscosity of the layer of compliant material comprises heating the layer of compliant material to a temperature greater than or equal to a glass transition temperature thereof.
19. The method of claim 16 , further comprising selecting the layer of compliant material to have a glass transition temperature of less than or equal to a deposition temperature of the layer of semiconductor material.
20. The method of claim 16 , further comprising selecting the layer of semiconductor material to comprise a III-V type semiconductor material.
21. The method of claim 16 , further comprising selecting the layer of semiconductor material to comprise indium gallium nitride.
22. The method of claim 16 , wherein growing another semiconductor material comprises laterally growing the another semiconductor material using the relaxed portions of the layer of semiconductor material as a seed material.
23. The method of claim 22 , wherein laterally growing the another semiconductor material comprises causing the another semiconductor material to adopt the lattice structure of the relaxed portions of the layer of semiconductor material.
24. The method of claim 16 , wherein growing the another semiconductor material over the relaxed portions of the layer of semiconductor material comprises laterally depositing the another semiconductor material to form a continuous layer of semiconductor material.
25. The method of claim 24 , further comprising vertically growing the another semiconductor material over the continuous layer of semiconductor material.
26. A method of fabricating a semiconductor structure or device, comprising:
removing a portion of each of a layer of semiconductor material and a layer of compliant material to form a plurality of openings;
altering a viscosity of the layer of compliant material to relax the layer of semiconductor material;
forming a layer of sacrificial material over the layer of semiconductor material and regions of the layer of compliant material exposed within the plurality of openings;
removing a portion of the layer of sacrificial material to expose surfaces of the layer of semiconductor material; and
growing laterally over the layer of sacrificial material the another semiconductor material using the layer of semiconductor material as a seed material.
27. The method of claim 26 , wherein removing a portion of each of a layer of semiconductor material and a layer of compliant material to form a plurality of openings comprises forming a plurality of openings extending though the layer of semiconductor material and only partially into the layer of compliant material.
28. The method of claim 26 , wherein altering a viscosity of the layer of compliant material comprises heating a layer of borophosphosilicate glass to a temperature above about 600° C.
29. The method of claim 26 , wherein altering a viscosity of the layer of compliant material comprises reflowing the layer of compliant material to form a substantially planar upper surface thereon.
30. The method of claim 26 , further comprising selecting the layer of semiconductor material to comprise at least one of indium gallium nitride and aluminum gallium nitride.
31. The method of claim 26 , wherein forming a layer of sacrificial material over the layer of semiconductor material and the regions of the layer of compliant material exposed within the plurality of openings comprises depositing a layer of anti-surfactant material.
32. The method of claim 31 , wherein depositing a layer of anti-surfactant material comprises depositing a layer of silicon nitride or a layer of silicon dioxide.
33. The method of claim 26 , wherein removing a portion of the layer of sacrificial material to expose surfaces of the layer of semiconductor material comprises planarizing the layer of sacrificial material to form a substantially planar surface.
34. The method of claim 33 , wherein planarizing the layer of sacrificial material comprises grinding, etching, or chemical mechanical polishing.
35. The method of claim 26 , wherein growing laterally over the layer of sacrificial material the another semiconductor material using the layer of semiconductor material as a seed material comprises growing another semiconductor material having a relaxed lattice structure.
36. The method of claim 26 , wherein growing laterally over the layer of sacrificial material the another semiconductor material using the layer of semiconductor material as a seed material comprises growing the another semiconductor material to form a continuous layer of semiconductor material having a lattice structure at least substantially the same as a lattice structure of the layer of semiconductor material.
37. The method of claim 26 , wherein growing laterally over the layer of sacrificial material the another semiconductor material using the the layer of semiconductor material as a seed material comprises depositing the another semiconductor material to form a continuous layer of semiconductor material.
38. A method of forming an engineered substrate, comprising:
forming an epitaxial layer of indium gallium nitride over a layer of glass material on a substrate;
removing a portion of the layer of indium gallium nitride and a portion of the layer of glass material to form a plurality of openings extending through the layer of indium gallium nitride and partially into the layer of glass material; and
exposing the layer of glass material to a temperature sufficient to decrease a viscosity thereof.
39. The method of claim 38 , wherein forming an epitaxial layer of indium gallium nitride over a layer of glass material on a substrate comprises:
growing the epitaxial layer of indium gallium nitride over another substrate;
attaching the layer of glass material to the layer of indium gallium nitride on a side thereof opposite the another substrate, the layer of glass material overlying the substrate; and
separating the another substrate from the layer of indium gallium nitride.
40. The method of claim 38 , wherein exposing the layer of glass material to a temperature sufficient to decrease a viscosity thereof comprises heating a layer of glass material comprising at least one of a low temperature oxide, a phosphosilicate glass, a borosilicate glass, a borophosphosilicate glass, a polyimide, a siloxane spin-on-glass, an inorganic spin-on-glass, or a silicate to the layer of indium gallium nitride.
41. The method of claim 38 , wherein exposing the layer of glass material to a temperature sufficient to decrease a viscosity thereof comprises heating the layer of glass material to a temperature above a glass transition temperature thereof.