IP Library Granted Patent US 8,696,811
Granted Patent B2
US 8,696,811 · App. 12/625,931 · Granted Apr 15, 2014

Method for feeding arsenic dopant into a silicon crystal growing apparatus

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Quick Facts
Patent No.
US 8,696,811
App. No.
12/625,931
Granted
Apr 15, 2014
Kind
B2
Abstract

A feed assembly and method of use thereof of the present invention is used for the addition of a high pressure dopant such as arsenic into a silicon melt for CZ growth of semiconductor silicon crystals. The feed assembly includes a vessel-and-valve assembly for holding dopant, and a feed tube assembly, attached to the vessel-and-valve assembly for delivering dopant to a silicon melt. An actuator is connected to the feed tube assembly and a receiving tube for advancing and retracting the feed tube assembly to and from the surface of the silicon melt. A brake assembly is attached to the actuator and the receiving tube for restricting movement of the feed tube assembly and locking the feed tube assembly at a selected position.

Claims (18)

1. A method for feeding arsenic dopant to a silicon melt in a silicon crystal growing apparatus having a crystal growing chamber comprising the steps of:

placing granular solid arsenic dopant in a vessel attached to a feed tube, the feed tube comprising a fixed tube and a movable tube in concentric arrangement;

lowering the moveable tube toward the silicon melt with an actuator connected to the moveable tube to selectively position the moveable tube at the upper surface of the silicon melt, the actuator comprising a linear translator magnetically coupled to the moveable tube; and

releasing the dopant from the vessel to allow dopant to travel down the feed tube and into the melt at the upper surface of the melt.

2. A method of claim 1 further comprising the steps of retracting the moveable tube with the actuator and cooling the feed tube by introducing argon gas into the feed tube.

3. A method of claim 2 further comprising the steps of isolating the feed tube from the growing apparatus with an isolation valve.

4. A method of claim 1 wherein a brake assembly attached to the moveable tube holds the moveable tube in a selected position for introducing the dopant material at the upper surface of the silicon melt.

5. A method for feeding arsenic dopant to a silicon melt in a silicon crystal growing apparatus having a crystal growing chamber, comprising the steps of:

placing granular solid arsenic dopant in a vessel attached to a feed tube comprising a fixed tube and a moveable quartz tube having an angled tip, the fixed tube and moveable quartz tube being in concentric arrangement;

lowering the moveable tube toward the silicon melt with an actuator connected to the moveable tube to selectively position the moveable tube at an upper surface of the silicon melt;

releasing the dopant from the vessel to allow the dopant to travel down the feed tube to a catch located in the moveable tube for catching the dopant material when it is released from the vessel; and

introducing argon gas into the feed tube below the vessel causing sublimation of the dopant resulting in dopant laden argon exiting the angled tip of the moveable quartz tube at the upper surface of the silicon melt.

6. A method of claim 5 further comprising the steps of:

retracting the moveable tube with the actuator; and

cooling the feed tube with argon gas.

7. A method of claim 6 further comprising the steps of isolating the feed tube from the growing apparatus with an isolation valve.

8. A method of claim 5 wherein the moveable tube is lowered by a linear translator magnetically coupled to the moveable tube.

9. A method of claim 8 wherein a brake assembly attached to the moveable tube holds the moveable tube in a selected position for introducing the dopant material at the upper surface of the silicon melt.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
NOTICE OF LICENSE AGREEMENT Recorded Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
SECURITY AGREEMENT Recorded Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
SECURITY AGREEMENT Recorded Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →