Flange for semiconductor die
View Patent ↗A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
1. A method of manufacturing a substrate assembly, comprising:
providing a substrate having a relatively flat surface;
placing a curved body on the relatively flat surface of the substrate, the curved body including first and second opposing end regions curved in a first direction facing the substrate and an intermediate center region curved in a second direction facing away from the substrate, the curved body having a plurality of semiconductor die attached to an upper surface of the curved body facing away from the substrate; and
bolting down the end regions of the curved body to the substrate so that a lower surface of the curved body flattens out and contacts the relatively flat surface of the substrate over a length of the curved body after bolting down.
2. The method of claim 1 , wherein the opposing end regions of the curved body point downward toward the substrate prior to bolting down.
3. The method of claim 1 , wherein the lower surface of the curved body is in direct contact with the relatively flat surface of the substrate after bolting down.
4. The method of claim 1 , wherein the substrate is a circuit board.
5. The method of claim 1 , further comprising stamping a single continuous metallic body to form the curved body with the center region having a convex curvature with a minimal extremum at a first inflection point, the first end region having a concave curvature with a maximal extremum at a second inflection point and the second end region having a concave curvature with a maximal extremum at a third inflection point.
6. The method of claim 5 , comprising stamping the single continuous metallic body so that the minimal extremum extends vertically beyond opposing ends of the curved body.
7. The method of claim 5 , comprising stamping the single continuous metallic body so that the opposing ends of the curved body point downward toward the substrate.
8. The method of claim 5 , comprising stamping the single continuous metallic body so that each concave curvature has a smaller radius than the convex curvature.
9. The method of claim 8 , comprising stamping the single continuous metallic body so that the radius of each concave curvature is about ⅙ the radius of the convex curvature.
10. A method of manufacturing a substrate assembly, comprising:
providing a substrate having a relatively flat surface;
placing a curved body on the relatively flat surface of the substrate, the curved body including first and second opposing end regions curved in a first direction facing the substrate and an intermediate center region curved in a second direction facing away from the substrate, the curved body having a plurality of semiconductor die attached to an upper surface of the curved body facing away from the substrate; and
fastening the curved body to the substrate so that a lower surface of the curved body flattens out and contacts the relatively flat surface of the substrate over a length of the curved body after fastening.
11. The method of claim 10 , wherein the opposing end regions of the curved body point downward toward the substrate prior to fastening.
12. The method of claim 10 , wherein the lower surface of the curved body is in direct contact with the relatively flat surface of the substrate after fastening.
13. The method of claim 10 , wherein the substrate is a circuit board.
14. The method of claim 10 , further comprising stamping a single continuous metallic body to form the curved body with the center region having a convex curvature with a minimal extremum at a first inflection point, the first end region having a concave curvature with a maximal extremum at a second inflection point and the second end region having a concave curvature with a maximal extremum at a third inflection point.
15. The method of claim 14 , comprising stamping the single continuous metallic body so that the minimal extremum extends vertically beyond opposing ends of the curved body.
16. The method of claim 14 , comprising stamping the single continuous metallic body so that the opposing ends of the curved body point downward toward the substrate.
17. The method of claim 14 , comprising stamping the single continuous metallic body so that each concave curvature has a smaller radius than the convex curvature.
18. The method of claim 17 , comprising stamping the single continuous metallic body so that the radius of each concave curvature is about ⅙ the radius of the convex curvature.