IP Library Assignment 045870/0504
Patent Assignment
Reel/Frame 045870/0504

Assignment of Assignor's Interest

Recorded: 2018-05-22 Pages: 23
Assignor
INFINEON TECHNOLOGIES AG
Executed: 2018-03-06
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties (45)
Output Matched Ldmos Power Transistor Device
Patent: 6,177,834 →
Application: 09/204,666 →
Inductance Device
Patent: 6,194,987 →
Application: 09/274,326 →
Gate Biasing Arrangement to Temperature Compensate a Quiescent Current of a Power Transistor
Patent: 6,288,596 →
Application: 09/489,947 →
Balun
Patent: 6,441,696 →
Application: 09/612,129 →
Gain and Bandwidth Enhancement for Rf Power Amplifier Package
Patent: 6,466,094 →
Application: 09/758,629 →
Publication: US 2002/0125955
Single Chip Push-Pull Power Transistor Device
Patent: 6,455,905 →
Application: 09/828,098 →
Publication: US 2002/0145184
Adaptive Biasing of Rf Power Transistors
Patent: 6,448,616 →
Application: 09/929,898 →
Automatic Ldmos Biasing with Long Term Hot Carrier Compensation
Patent: 6,573,796 →
Application: 09/962,975 →
Publication: US 2003/0058051
Rf Power Transistor with Internal Bias Feed
Patent: 6,734,728 →
Application: 10/324,694 →
Adjustable Gain Amplifier Arrangement with Relaxed Manufacturing Constraints
Patent: 7,009,449 →
Application: 10/822,633 →
Publication: US 2004/0227574
Monolithically Integrated Power Amplifier Device
Patent: 7,098,741 →
Application: 10/882,868 →
Publication: US 2005/0046484
Differential Amplifier Arrangement with Current Regulating Circuit and Method for Operating a Differential Amplifier Arrangement
Patent: 7,095,281 →
Application: 10/949,432 →
Publication: US 2005/0099233
Output Match Transistor
Patent: 7,372,334 →
Application: 11/189,615 →
Publication: US 2007/0024374
Integrated Circuit Esd Protection
Patent: 7,719,025 →
Application: 11/550,650 →
Publication: US 2008/0093624
Semiconductor Power Device with Bias Circuit
Patent: 7,728,671 →
Application: 12/015,890 →
Publication: US 2009/0184756
Stripline Balun
Patent: 7,902,939 →
Application: 12/253,323 →
Publication: US 2010/0097155
Flange for Semiconductor Die
Patent: 8,314,487 →
Application: 12/641,496 →
Publication: US 2011/0147921
Power Transistor Output Match Network with High Q Rf Path and Low Q Low Frequency Path
Patent: 8,299,856 →
Application: 12/973,613 →
Publication: US 2012/0154053
Wideband Doherty Amplifier Circuit
Patent: 8,193,857 →
Application: 13/037,813 →
Wideband Doherty Amplifier Circuit Having a Constant Impedance Combiner
Patent: 8,339,201 →
Application: 13/163,388 →
Publication: US 2012/0319780
System and Method for Wafer Level Packaging
Patent: 8,497,558 →
Application: 13/183,272 →
Publication: US 2013/0015467
Rf Device with Compensatory Resonator Matching Topology
Patent: 8,717,102 →
Application: 13/246,344 →
Publication: US 2013/0076446
Wideband Doherty Amplifier Circuit with Peaking Impedance Absorption
Patent: 8,717,099 →
Application: 13/422,938 →
Publication: US 2013/0241639
Wideband Doherty Amplifier Circuit with Impedance Combiner
Patent: 8,384,482 →
Application: 13/616,845 →
Publication: US 2013/0009708
Flange for Semiconductor Die
Patent: 8,604,609 →
Application: 13/654,489 →
Publication: US 2013/0037932
Doherty Amplifier Circuit with Phase-Controlled Load Modulation
Patent: 8,779,856 →
Application: 13/665,321 →
Publication: US 2014/0118070
Input Match Network for a Power Circuit
Patent: 8,736,379 →
Application: 13/763,373 →
Hybrid Semiconductor Package
Patent: 9,373,577 →
Application: 13/899,048 →
Publication: US 2014/0346637
Transformer Input Matched Transistor
Patent: 9,337,183 →
Application: 14/069,867 →
Publication: US 2015/0123208
Input Match Network with Rf Bypass Path
Patent: 8,970,308 →
Application: 14/254,034 →
Publication: US 2014/0225672
Semiconductor Device Package Having Asymmetric Chip Mounting Area and Lead Widths
Patent: 9,209,116 →
Application: 14/297,189 →
Publication: US 2015/0340306
Inductively Coupled Transformer with Tunable Impedance Match Network
Patent: 9,589,916 →
Application: 14/618,305 →
Publication: US 2016/0233849
Multi-Cavity Package Having Single Metal Flange
Application: 14/673,928 →
Publication: US 2016/0294340
PCB Based Semiconductor Package Having Integrated Electrical Functionality
Patent: 9,629,246 →
Application: 14/811,325 →
Publication: US 2017/0034913
Multi-Die Package Having Different Types of Semiconductor Dies Attached to the Same Thermally Conductive Flange
Patent: 9,997,476 →
Application: 14/928,812 →
Publication: US 2017/0125362
RF Device Package with Integrated Hybrid Coupler
Patent: 9,628,032 →
Application: 14/966,474 →
PCB Based Semiconductor Package with Impedance Matching Network Elements Integrated Therein
Application: 15/046,923 →
Publication: US 2017/0245359
LC Network for a Power Amplifier with Selectable Impedance
Application: 15/078,298 →
Publication: US 2017/0279419
Embedded Harmonic Termination on High Power RF Transistor
Patent: 9,899,967 →
Application: 15/421,567 →
Die-Attach Method to Compensate for Thermal Expansion
Application: 15/673,734 →
Publication: US 2019/0051617
RF Amplifier Package with Biasing Strip
Application: 15/709,532 →
Broadband Harmonic Matching Network
Application: 15/709,593 →
Rivetless Lead Fastening for a Semiconductor Package
Application: 15/727,725 →
Publication: US 2019/0109070
RF Power Amplifier with Combined Baseband, Fundamental and Harmonic Tuning Network
Application: 15/823,155 →
Publication: US 2019/0165753
RF Power Amplifier with Frequency Selective Impedance Matching Network
Application: 15/879,621 →
Publication: US 2019/0229686
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 5, 2010
From: MOHAMMED, ANWAR A.; CHEW, SOON ING; FOWLKES, DONALD; KOMPOSCH, ALEXANDER
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 023734/0312 →
Assignment of Assignor's Interest Feb 18, 2010
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 023953/0099 →
Assignment of Assignor's Interest May 7, 2012
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 028164/0646 →
Change of Name Jan 19, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 058774/0432 →
Change of Name Feb 14, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 059085/0667 →
Security Interest Jun 30, 2023
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 064185/0755 →
Change of Name Aug 16, 2023
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 064615/0365 →
Assignment of Assignor's Interest Dec 29, 2023
From: WOLFSPEED, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 066236/0086 →
Release of Security Interest in Intellectual Property Collateral at Reel/Frame No. 64185/0755 Sep 30, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 072989/0001 →
Notice of Grant of Security Interest in Intellectual Property Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0113 →
Notice of Grant of Security Interest in Intellectual Property Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0381 →
Notice of Grant of Security Interest in Intellectual Property Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0467 →
Notice of Grant of Security Interest in Intellectual Property Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0588 →
Notice of Grant of Security Interest in Intellectual Property Mar 26, 2026
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 075280/0919 →