Semiconductor device test circuit, semiconductor device, and its manufacturing method
The test circuit can apply a stress to each node of each object combinational circuit in the semiconductor device and suppress the semiconductor circuit overhead when in burn-in or leak test operations for the semiconductor device while it has been impossible to apply such a stress to any of such nodes only with use of an F/F circuit in any conventional environments. The test circuit is disposed in the semiconductor and combined with first and second combinational circuits therein. In the semiconductor device, a transfer gate switch is connected between first and second nodes and a first transistor is connected between the second node and a power supply. The second transistor is connected between the second node and a ground. Each of the transfer gate switch and the first and second transistors operates according to at least one of the control signals supplied from outside the semiconductor device.
1. A test circuit disposed in a semiconductor device and combined with a combinational circuit therein, comprising:
a first switching circuit connected between a first node and a second node;
a second switching circuit connected between a first potential and the second node; and
a third switching circuit connected between a second potential that is lower than the first potential and the second node,
wherein each of the first to third switching circuits is turned on/off according to at least one control signal supplied from external, and
wherein the test circuit is disposed together with the combinational circuit between plural flip-flop circuits included in a scan chain or between a flip-flop circuit included in the scan chain and a signal terminal of the semiconductor device.
2. A test circuit disposed in a semiconductor device and combined with a combinational circuit therein, comprising:
a first switching circuit connected between a first node and a second node;
a second switching circuit connected between a first potential and the second node; and
a third switching circuit connected between a second potential that is lower than the first potential and the second node,
wherein each of the first to third switching circuits is turned on/off according to at least one control signal supplied from external, and
wherein the operations of the first to third switching circuits are independent of each other.
3. A test circuit disposed in a semiconductor device and combined with a combinational circuit therein, comprising:
a first switching circuit connected between a first node and a second node;
a second switching circuit connected between a first potential and the second node; and
a third switching circuit connected between a second potential that is lower than the first potential and the second node,
wherein each of the first to third switching circuits is turned on/off according to at least one control signal supplied from external, and
wherein the second and third switching circuits can be turned off when the first switching circuit is turned on; and
wherein either the second or third switching circuit can be turned on when the first switching circuit is turned off.
4. The test circuit according to claim 3 ,
wherein the operations of the second and third switching circuits are synchronized with a clock signal.
5. The test circuit according to claim 4 ,
wherein the clock signal is a scan clock signal supplied to the flip-flop circuits included in the scan chain when in scanning test operation.