Heat spreader package and method

1. A heat spreader package comprising:

a substrate comprising a first surface;

first traces on the first surface of the substrate;

an electronic component comprising an inactive surface mounted to the first surface of the substrate, the electronic component further comprising an active surface comprising bond pads;

bond wires electrically connecting the bond pads to the first traces; and

an inverted pyramid heat spreader comprising:

a first heatsink;

a first heatsink adhesive directly connecting the first heatsink to the active surface of the electronic component inward of the bond pads;

a second heatsink having an absence of active circuitry; and

a second heatsink adhesive directly connecting a first surface of the second heatsink to the first heatsink, the bond wires directly contacting the second heatsink adhesive, the second heatsink adhesive being a dielectric directly between the bond wires and the second heatsink to prevent shorting between the bond wires and the second heatsink.

2. The heat spreader package of claim 1 wherein the

substrate comprises sides, wherein the second heatsink further comprises sides, the sides of the second heatsink being parallel to and co-planar with the sides of the substrate.

3. The heat spreader package of claim 2 further comprising a package body, the package body comprising a principal surface directly contacting the second heatsink adhesive.

4. The heat spreader package of claim 1 further comprising:

a package body, the package body comprising a principal surface parallel to and coplanar with a second surface the second heatsink.

5. A heat spreader package comprising

an electronic component;

an inverted pyramid heat spreader thermally connected to the electronic component, the inverted pyramid heat spreader comprising:

a first heatsink;

a first heatsink adhesive directly connecting the first heatsink to the electronic component;

a second heatsink having an absence of active circuitry; and

a second heatsink adhesive directly connecting a first surface of the second heatsink to the first heatsink, the second heatsink adhesive entirely covering the first surface the second heatsink; and

a package body, the package body comprising a principal surface parallel to and coplanar with a second surface the second heatsink.

6. The heat spreader package of claim 5 wherein the first heatsink includes a first surface, a second surface, and sides extending between the first surface and the second surface the first heatsink, the first surface of the first heatsink being directly attached to the electronic component by the first heatsink adhesive.

7. The heat spreader package of claim 6 wherein the first surface of the first heatsink has an area less than an area of an active surface of the electronic component.

8. The heat spreader package of claim 7 wherein the active surface comprises bond pads, the first heatsink being mounted to the active surface inward of the bond pads.

9. The heat spreader package of claim 8 wherein the sides of the first heatsink are inward of sides of the electronic component.

10. The heat spreader package of claim 8 wherein the first surface of the second heatsink has an area greater than the active surface.

11. The heat spreader package of claim 10 wherein the second heatsink is located directly above the bond pads.

12. The heat spreader package of claim 10 wherein the second heatsink adhesive is directly between the bond pads and the second heatsink.

13. The heat spreader package of claim 10 further comprising:

a substrate comprising a first surface, wherein an inactive surface of the electronic component is mounted to the first surface of the substrate;

first traces on the first surface of the substrate; and

bond wires electrically connecting the bond pads to the first traces, the second heatsink adhesive being directly between the bond wires and the second heatsink.

14. The heat spreader package of claim 13 wherein the second heatsink adhesive prevents shorting between the bond wires and the second heatsink.

15. The heat spreader package of claim 5 further comprising:

a substrate comprising sides, wherein the second heatsink further comprises sides, the sides of the second heatsink being inwards of the sides of the substrate.

16. The heat spreader package of claim 5 further comprising:

a substrate comprising first traces; and

flip chip bumps physically and electrically connecting bond pads on an active surface of the electronic component to the first traces, wherein the first heatsink is directly attached to an inactive surface of the electronic component by the first heatsink adhesive.

17. The heat spreader package of claim 16 wherein the first surface of the first heatsink has an area less than an area of the inactive surface of the electronic component.

18. The heat spreader package of claim 16 wherein the first surface of the first heatsink has an area equal to or greater than an area of the inactive surface of the electronic component.

19. The heat spreader package of claim 5 further comprising:

a substrate comprising traces, wherein an inactive surface the electronic component is coupled to the substrate; and

bond wires coupling bond pads on an active surface of the electronic component to the traces, the bond wires directly contacting the second heatsink adhesive.

20. A heat spreader package comprising:

an electronic component;

an inverted pyramid heat spreader comprising:

a first dummy silicon heatsink;

a first heatsink adhesive directly connecting the first dummy silicon heatsink to the electronic component;

a second dummy silicon heatsink; and

a second heatsink adhesive directly connecting a first surface the second dummy silicon heatsink to the first dummy silicon heatsink, the second heatsink adhesive entirely covering the first surface the second dummy silicon heatsink;

a package body enclosing at least a portion of the electronic component, wherein the first dummy silicon heatsink and the second dummy silicon heatsink having a higher thermal conductivity than the package body;

a substrate comprising traces, wherein an inactive surface of the electronic component is coupled to the substrate; and

bond wires coupling bond pads on an active surface of the electronic component to the traces, the bond wires directly contacting the second heatsink adhesive, wherein the second heatsink adhesive prevents shorting of the bond wires to the second dummy silicon heatsink.