Non-amine post-CMP composition and method of use
View Patent ↗A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
1. A cleaning composition comprising at least one basic salt, at least one organic solvent, at least one complexing agent, and water, wherein the at least one basic salt comprises a species selected from the group consisting of cesium hydroxide, rubidium hydroxide, and combinations thereof, wherein the composition is substantially devoid of amine and ammonium-containing salts and is devoid of fluoride-containing sources, and wherein the amount of at least one organic solvent is in a range from about 4 to about 12 wt %, based on the total weight of the composition.
2. The cleaning composition of claim 1 , wherein the at least one basic salt comprises cesium hydroxide.
3. The cleaning composition of claim 1 , wherein the at least one basic salt comprises rubidium hydroxide.
4. The cleaning composition of claim 1 , wherein the at least one organic solvent comprises a glycol, a sulfone, or a combination thereof
5. The cleaning composition of claim 1 , wherein the at least one organic solvent comprises a species selected from the group consisting of ethylene glycol, propylene glycol, neopentyl glycol, glycerine, diethylene glycol, dipropylene glycol, 1,4-butanediol, 2,3-butylene glycol, 1,3-pentanediol, 1,4-pentanediol, 1,5-pentanediol, tetramethylene sulfone (sulfolane), dimethyl sulfone, diethyl sulfone, bis(2-hydroxyethyl) sulfone, methyl sulfolane, ethyl sulfolane, and combinations thereof.
6. The cleaning composition of claim 1 , wherein the at least one organic solvent comprises a species selected from the group consisting of ethylene glycol, propylene glycol, glycerine, and combinations thereof.
7. The cleaning composition of claim 1 , wherein the at least one complexing agent comprises a species selected from the group consisting of ethylenediaminetetraacetic acid (EDTA), 1,2-cyclohexanediamine-N,N,N′,N′-tetraacetic acid (CDTA), glycine, ascorbic acid, iminodiacetic acid (IDA), nitrilotriacetic acid, alanine, arginine, asparagine, aspartic acid, cysteine, glutamic acid, glutamine, histidine, isoleucine, leucine, lysine, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, valine, gallic acid, boric acid, acetic acid, acetone oxime, acrylic acid, adipic acid, betaine, dimethyl glyoxime, formic acid, fumaric acid, gluconic acid, glutaric acid, glyceric acid, glycolic acid, glyoxylic acid, isophthalic acid, itaconic acid, lactic acid, maleic acid, maleic anhydride, malic acid, malonic acid, mandelic acid, 2,4-pentanedione, phenylacetic acid, phthalic acid, proline, propionic acid, pyrocatecol, pyromellitic acid, quinic acid, sorbitol, succinic acid, tartaric acid, terephthalic acid, trimellitic acid, trimesic acid, tyrosine, xylitol, salts thereof, derivatives thereof, and combinations thereof.
8. The cleaning composition of claim 1 , wherein the at least one complexing agent comprises a species selected from the group consisting of iminodiacetic acid (IDA), gallic acid, boric acid, and combinations thereof.
9. The cleaning compositions of claim 1 , wherein the compositions are substantially devoid of oxidizing agents; abrasive materials; alkaline earth metal bases; cross-linked organic polymer particles; and combinations thereof.
10. The cleaning compositions of claim 1 , wherein the composition is selected from the group consisting of: (a) cesium hydroxide, glycerine, iminodiacetic acid and water, (b) cesium hydroxide, glycerine, boric acid and water, (c) cesium hydroxide, propylene glycol, gallic acid and water, (d) cesium hydroxide, ethylene glycol, iminodiacetic acid and water, and (e) cesium hydroxide, propylene glycol, boric acid, and water.
11. The cleaning composition of claim 1 , further comprising residue and contaminants, wherein the residue comprises post-CMP residue, post-etch residue, post-ash residue, or combinations thereof.
12. The cleaning composition of claim 1 , wherein the composition is diluted in a range from about 10:1 to about 1000:1.
13. The cleaning composition of claim 1 , wherein the cleaning compositions do not solidify to form a polymeric solid.
14. The cleaning composition of claim 1 , further comprising at least one surfactant.
15. A kit comprising, in one or more containers, the reagents for forming a cleaning composition, said cleaning composition comprising at least one basic salt, at least one organic solvent, at least one complexing agent, and water, wherein the at least one basic salt comprises a species selected from the group consisting of cesium hydroxide, rubidium hydroxide, and combinations thereof, and wherein the composition is substantially devoid of amine and ammonium-containing salts and devoid of fluoride-containing sources, and wherein the amount of at least one organic solvent is in a range from about 4 to about 12 wt %, based on the total weight of the composition.
16. A method of removing residue and contaminants from a microelectronic device having said residue and contaminants thereon, said method comprising contacting the microelectronic device with a cleaning composition for sufficient time to at least partially clean said residue and contaminants from the microelectronic device, wherein the cleaning composition includes at least one basic salt; at least one organic solvent; at least one chelating agent; optionally at least one surfactant; and water, wherein the at least one basic salt comprises a species selected from the group consisting of cesium hydroxide, rubidium hydroxide, and combinations thereof, and wherein the composition is substantially devoid of amine and ammonium-containing salts and devoid of fluoride-containing sources, and wherein the amount of at least one organic solvent is in a range from about 4 to about 12 wt %, based on the total weight of the composition.
17. The method of claim 16 , wherein the residue comprises post-CMP residue, post-etch residue, post-ash residue, or combinations thereof.
18. The method of claim 16 , wherein said contacting comprises conditions selected from the group consisting of: time of from about 15 seconds to about 5 minutes; temperature in a range of from about 20° C. to about 50° C.; and combinations thereof.
19. The method of claim 16 , further comprising diluting the cleaning composition with solvent at or before a point of use.