IP Library Granted Patent US 8,274,063
Granted Patent B2
US 8,274,063 · App. 12/733,091 · Granted Sep 25, 2012

Composite focused ion beam device, process observation method using the same, and processing method

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Quick Facts
Patent No.
US 8,274,063
App. No.
12/733,091
Granted
Sep 25, 2012
Kind
B2
Abstract

A composite focused ion beam device has a first ion beam irradiation system that irradiates a first ion beam for processing a sample and a second ion beam irradiation system that irradiates a second ion beam for processing or observing the sample. The first ion beam irradiation system has a plasma type gas ion source that generates first ions for forming the first ion beam, each of the first ions having a first mass. The second ion beam irradiation system has a gas field ion source that generates second ions for forming the second ion beam. Each of the second ions has a second mass smaller than that of the first mass.

Claims (26)

1. A composite focused ion beam device comprising:

a first ion beam irradiation system that irradiates a first ion beam for processing a sample, the first ion beam irradiation system having a plasma type gas ion source that generates first ions for forming the first ion beam, the first ions each having a first mass; and

a second ion beam irradiation system that irradiates a second ion beam for processing or observing the sample, the second ion beam irradiation system having a gas field ion source that generates second ions for forming the second ion beam, the second ions each having a second mass smaller than that of the first mass.

2. A processing and observation method of a sample, the method comprising the steps of:

processing a sample by irradiating the sample with a first ion beam from a first ion beam irradiation system having a plasma type gas ion source that generates first ions for forming the first ion beam, the first ions each having a first mass; and

observing the sample by irradiating the sample with a second ion beam from a second ion beam irradiation system having a gas field ion source that generates second ions for forming the second ion beam, the second ions each having a second mass smaller than the first mass.

3. A processing and observation method according to claim 2 ; wherein the first and second ion beams are simultaneously irradiated on the sample.

4. A processing method of a sample, the method comprising the steps of:

performing rough processing of a sample by irradiating the sample with a first ion beam from a first ion beam irradiation system having a plasma type gas ion source that generates first ions for forming the first ion beam, the first ions each having a first mass; and

performing finishing processing of the sample by irradiating the sample with a second ion beam from a second ion beam irradiation system having a gas field ion source that generates second ions for forming the second ion beam, the second ions each having a second mass smaller than that of the first mass.

5. A composite focused ion beam device according to claim 1 ; further comprising an electron beam irradiation system for observing the sample.

6. A composite focused ion beam device according to claim 1 ; wherein the first ion beam irradiation system and the second ion beam irradiation system are configured to irradiate the first ion beam and the second ion beam, respectively, so as to cross each other at an acute angle.

7. A composite focused ion beam device according to claim 6 ; further comprising a sample pedestal for supporting the sample irradiated by the first and second ion beams, the second ion beam irradiation system being disposed on an upper side of the sample pedestal and the first ion beam irradiation system being positioned obliquely to a vertical direction of the second ion beam irradiation system.

8. A composite focused ion beam device according to claim 1 ; wherein the first ion beam irradiation system and the second ion beam irradiation system are configured to irradiate the first ion beam and the second ion beam, respectively, so as to be substantially orthogonal to each other.

9. A composite focused ion beam device according to claim 1 ; wherein the first ion beam irradiation system and the second ion beam irradiation system are configured to irradiate the first ion beam and the second ion beam, respectively, so as to be substantially parallel to each other.

10. A composite focused ion beam device according to claim 1 ; wherein the second ion is a helium ion.

11. A composite focused ion beam device according to claim 1 ; the first ion is one or more of rare gas ions selected from neon, argon, xenon and krypton.

12. A composite focused ion beam device according to claim 1 ; further comprising: a detection device for detecting at least one of a secondary charged particle generated or reflected from the sample by the irradiation of the first ion beam or the second ion beam, and a charged particle transmitted through the sample; and an image display device for displaying an image of the sample based on an output of the detection device.

13. A composite focused ion beam device according to claim 12 ; wherein the detection device comprises at least one of an electron detector, an ion detector, and a transmitted charged particle detector.

14. A processing and observation method according to claim 2 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams cross each other at an acute angle.

15. A processing and observation method according to claim 2 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams are substantially orthogonal to each other.

16. A processing and observation method according to claim 2 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams are substantially parallel to each other.

17. A processing method according to claim 4 ; wherein the first and second ion beams are simultaneously irradiated on the sample.

18. A processing method according to claim 4 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams cross each other at an acute angle.

19. A processing method according to claim 4 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams are substantially orthogonal to each other.

20. A processing method according to claim 4 ; wherein the sample is irradiated with the first ion beam and the second ion beam so that the first and second ion beams are substantially parallel to each other.

Assignments (4)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0543 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072907/0356 →
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2010
From: KAITO, TAKASHI; NAKAGAWA, YOSHITOMO; TASHIRO, JUNICHI; SUGIYAMA, YASUHIKO; FUJII, TOSHIAKI; AITA, KAZUO; OGAWA, TAKASHI
To: SII NANOTECHNOLOGY INC.
Reel/Frame 024113/0195 →