IP Library Granted Patent US 7,915,981
Granted Patent B2
US 7,915,981 · App. 12/788,328 · Granted Mar 29, 2011

Coaxial-to-microstrip transitions

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Quick Facts
Patent No.
US 7,915,981
App. No.
12/788,328
Granted
Mar 29, 2011
Kind
B2
Abstract

Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Claims (57)

1. A coaxial-to-microstrip transition comprising:

a microstrip line including:

a first dielectric having a first primary face and a second primary face opposite the first primary face,

a conductive strip disposed on the first primary face of the first dielectric, and

a ground plane disposed on the second primary face of the first dielectric; and

a coaxial-line assembly extending along an axis transverse to the ground plane and having an end adjacent to the microstrip line, the coaxial-line assembly including:

an outer conductor extending along the axis to the ground plane, an end of the outer conductor being in contact with the ground plane, and

an inner conductor extending along the axis past the ground plane and being electrically connected to the conductive strip;

wherein the ground plane extends to a position between the outer conductor and the inner conductor on only a first side of the coaxial-line assembly proximate the conductive strip, and

wherein the microstrip line further includes a first aperture extending through the ground plane and through which the inner conductor extends, the aperture extending beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip.

2. The coaxial-to-microstrip transition of claim 1 , wherein the ground plane includes a curved edge proximate the inner conductor, the curved edge being convex relative to the inner conductor such that the ground plane curves away from the inner conductor.

3. The coaxial-to-microstrip transition of claim 1 , wherein the first dielectric contacts the inner conductor on the first side of the coaxial-line assembly.

4. The coaxial-to-microstrip transition of claim 1 , further comprising a second aperture extending through the first dielectric.

5. The coaxial-to-microstrip transition of claim 4 , wherein the second aperture is plated with a conducting material connected to the ground plane to form a via.

6. The coaxial-to-microstrip transition of claim 4 , wherein the ground plane is recessed from the second aperture on the first side of the coaxial-line assembly.

7. The coaxial-to-microstrip transition of claim 6 , wherein the first dielectric contacts the inner conductor on the first side of the coaxial-line assembly.

8. A coaxial-to-microstrip transition comprising:

a microstrip line including:

a first dielectric having a first primary face and a second primary face opposite the first primary face,

a ground plane disposed on the second primary face of the first dielectric,

a conductive strip disposed on the first primary face of the first dielectric, and

a first aperture extending through the ground plane and having a non-circular cross section in a plane of the ground plane; and

a coaxial-line assembly extending along an axis transverse to the ground plane and being adjacent the microstrip line, the coaxial-line assembly including:

an outer conductor extending along the axis to the ground plane, the outer conductor being in contact with the ground plane, and

an inner conductor extending along the axis into the first aperture and being electrically connected to the conductive strip,

wherein the ground plane extends to a position between the outer conductor and the inner conductor on only a first side of the coaxial-line assembly proximate the conductive strip and wherein the first aperture extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip.

9. The coaxial-to-microstrip transition of claim 8 , wherein the first aperture has an oval, a rectangular, a square, or a diamond shaped cross-section.

10. The coaxial-to-microstrip transition of claim 9 , wherein the inner conductor is asymmetrically disposed within the first aperture when viewed along the axis.

11. The coaxial-to-microstrip transition of claim 8 , wherein the microstrip line includes a second aperture that extends through the first dielectric, the second aperture being in communication with the first aperture and being plated with a conducting material to form a via.

12. The coaxial-to-microstrip transition of claim 11 , wherein at least one of the first and second apertures has an oval, a rectangular, a square, or a diamond shaped cross section.

13. The coaxial-to-microstrip transition of claim 12 , wherein the inner conductor is asymmetrically disposed within both the first and second apertures when viewed along the axis.

14. A coaxial-to-microstrip transition comprising:

a microstrip line including:

a first dielectric having a first primary face and a second primary face opposite the first primary face,

a conductive strip disposed on the first primary face of the first dielectric,

a ground plane disposed on the second primary face of the first dielectric, and

a first aperture extending through the ground plane and having a cross section defining an aperture area; and

a coaxial-line assembly extending along an axis transverse to the ground plane and being adjacent the microstrip line, the coaxial-line assembly including:

an outer conductor in contact with the ground plane and having a cross section, in a plane parallel and proximate to the ground plane, defining an enclosed area, the ground plane overlapping a portion of the enclosed area on a first side of the coaxial-line assembly proximate the conductive strip and the first aperture extending beyond the outer conductor on a second side of the coaxial-line assembly opposite the first side, and

an inner conductor extending along the axis into the first aperture and being electrically connected to the conductive strip.

15. The coaxial-to-microstrip transition of claim 14 , wherein the ground plane includes a curved edge proximate the inner conductor, the curved edge being convex relative to the inner conductor such that the ground plane curves away from the inner conductor.

16. The coaxial-to-microstrip transition of claim 14 , wherein the enclosed area is less than the aperture area.

17. The coaxial-to-microstrip transition of claim 14 , further comprising a second aperture extending through the first dielectric, wherein the second aperture conforms to the first aperture.

18. A coaxial-to-microstrip transition comprising:

a microstrip line including:

a first dielectric having a first primary face and a second primary face opposite the first primary face,

a conductive strip disposed on the first primary face of the first dielectric,

a ground plane disposed on the second primary face of the first dielectric, and

a first aperture extending through the ground plane, the first aperture having a first-aperture width; and

a coaxial-line assembly extending along an axis transverse to the ground plane and having an end adjacent to the microstrip line, the coaxial-line assembly including:

an inner conductor extending along the axis into the first aperture and being electrically connected to the conductive strip, and

an outer conductor extending along the axis to the ground plane, the outer conductor surrounding the inner conductor and having a cross section defining an enclosed area, the enclosed area having a width that is smaller than the first-aperture width, an end of the outer conductor being in contact with the ground plane,

wherein the ground plane overlaps the enclosed area only on the first side of the coaxial-line assembly.

19. The coaxial-to-microstrip transition of claim 18 , wherein the ground plane includes a curved edge proximate the inner conductor, the curved edge being convex relative to the inner conductor such that the ground plane curves away from the inner conductor.

20. The coaxial-to-microstrip transition of claim 18 , further comprising a second aperture extending through the first dielectric, wherein the second aperture conforms to the first aperture.

21. The coaxial-to-microstrip transition of claim 18 , wherein the first-aperture width is orthogonal to a strip plane defined by the axis and a line passing from the conductive strip to the inner conductor.

22. The coaxial-to-microstrip transition of claim 21 , wherein the enclosed area width is orthogonal to the strip plane.

Assignments (12)
NOTICE OF SUCCESSOR AGENT AND ASSIGNMENT OF SECURITY INTEREST IN REEL/FRAME 038589/0305 Recorded Nov 7, 2025
From: BANK OF AMERICA, N.A., AS PREDECESSOR AGENT
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS SUCCESSOR AGENT
Reel/Frame 073506/0385 →
CHANGE OF NAME Recorded Sep 26, 2024
From: MICROSEMI CORP. - MEMORY AND STORAGE SOLUTIONS
To: MERCURY CORP. - MEMORY AND STORAGE SOLUTIONS
Reel/Frame 069065/0921 →
MERGER Recorded Sep 26, 2024
From: MERCURY CORP. - MEMORY AND STORAGE SOLUTIONS
To: MERCURY SYSTEMS, INC.
Reel/Frame 068713/0857 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 3, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI LLC - RF INTEGRATED SOLUTIONS; MICROSEMI CORPORATION; MICROSEMI CORP. - MEMORY AND STORAGE SOLUTIONS
Reel/Frame 038599/0667 →
SECURITY AGREEMENT Recorded May 2, 2016
From: MERCURY SYSTEMS, INC.; MERCURY DEFENSE SYSTEMS, INC.; MICROSEMI CORP.-SECURITY SOLUTIONS; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 038589/0305 →
REGISTERED IP ASSIGNMENT AGREEMENT Recorded Apr 25, 2016
From: MICROSEMI CORPORATION
To: MICROSEMI CORP. - MEMORY AND STORAGE SOLUTIONS
Reel/Frame 038521/0378 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →