Integrated circuit package system with multiple device units and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package system includes: forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnects; encapsulating with an encapsulation covering the integrated circuit die, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed; and forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects.
1. A method for manufacturing an integrated circuit package system comprising:
forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration;
mounting an integrated circuit die over the first device unit;
connecting the integrated circuit die and the first external interconnects;
encapsulating with an encapsulation covering the integrated circuit die, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed; and
forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects.
2. The method as claimed in claim 1 further comprising connecting the integrated circuit die and the second external interconnects.
3. The method as claimed in claim 1 further comprising forming a bridging structure between the first device unit and the second device unit with the bridging structure between the first external interconnects and the second external interconnects.
4. The method as claimed in claim 1 wherein forming the first device unit and the second device unit includes forming the first device unit having a different configuration than the second device unit.
5. The method as claimed in claim 1 wherein mounting the integrated circuit die over the first device unit includes mounting the integrated circuit die over the second device unit.
6. A method for manufacturing an integrated circuit package system comprising:
forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration;
mounting an integrated circuit die over the first device unit;
connecting the integrated circuit die and the first external interconnects;
mounting a device over the second device unit;
connecting the device and the second external interconnects;
encapsulating with an encapsulation covering the integrated circuit die, the device, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed; and
forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects.
7. The method as claimed in claim 6 wherein mounting the device over the second device unit includes mounting a further integrated circuit die.
8. The method as claimed in claim 6 wherein mounting the device over the second device unit includes mounting a passive component.
9. The method as claimed in claim 6 wherein forming the first device unit and the second device unit in the array configuration includes forming the first device unit and the second device unit in an ‘m’ by ‘n’ array configuration where ‘m’ and ‘n’ are not equal.
10. An integrated circuit package system comprising:
a first device unit having first external interconnects along a perimeter of the first device unit;
a second device unit, having second external interconnects along the perimeter of the second device unit, in an array configuration with the first device unit;
an integrated circuit die over the first device unit and connected with the first external interconnects; and
an encapsulation, having a partial cut, over the integrated circuit die, the device, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed with the partial cut electrically isolating the first external interconnects and the second electrical interconnects.
11. The system as claimed in claim 10 wherein the integrated circuit die is connected with the second external interconnects.
12. The system as claimed in claim 10 further comprising a bridging structure between the first device unit and the second device unit with the bridging structure between the first external interconnects and the second external interconnects.
13. The system as claimed in claim 10 wherein the first device unit is of a different configuration than the second device unit.
14. The system as claimed in claim 10 wherein the integrated circuit die is over the second device unit.
15. The system as claimed in claim 10 further comprising:
a device over the second device unit and connected with the second external interconnects; and
wherein:
the encapsulation is over the device.
16. The system as claimed in claim 15 wherein the device includes a further integrated circuit die.
17. The system as claimed in claim 15 wherein the device includes a passive component.
18. The system as claimed in claim 15 wherein the first device unit and the second device unit in the array configuration includes the first device unit and the second device unit in an ‘m’ by ‘n’ array configuration where ‘m’ and ‘n’ are not equal.