Method of joining a semiconductor device/chip to a printed wiring board

1. A method of joining a semiconductor device/chip to a printed wiring board through a multilayer flexible substrate, the steps comprising:

a) providing a semiconductor device having a first set of pads disposed on one surface thereof, said pads having predetermined small dimensions and a fine pitch;

b) providing a printed wiring board having a first and a second surface, with a site on said first surface thereof for attaching a semiconductor device through a multilayer flexible substrate, the site having a second set of pads on said first surface of said printed wiring board with dimensions and spacing substantially greater than those of said first set of pads;

c) providing a multilayer flexible substrate having a first surface with a first set of substrate pads having dimensions and spacing corresponding to said first set of pads on said semiconductor device, and a second surface with a second set of substrate pads having dimensions and spacing corresponding to said second set of pads on said first surface of said printed wiring board, the first set of substrate pads of said semiconductor device being in electrical communication, through the flexible substrate, with said second set of substrate pads on said first surface of said printed wiring board;

d) joining the semiconductor device pads to said first set of substrate pads on said multilayer flexible substrate to obtain a flexible chip-on-a-carrier; and

e) joining said second surface of said flexible chip-on-a-carrier to the site on said first side of said printed wiring board.

2. The method according to claim 1 , wherein said joining step (e) is permanent, preventing said chip-on-a-carrier from being detached from said printed wiring board.

3. The method according to claim 1 , wherein said joining step (d) is permanent, preventing said chip-on-a-carrier from being detached from said printed wiring board.

4. The method according to claim 1 , wherein said joining step (d) is accomplished by a thermal process.

5. The method according to claim 1 , wherein said joining step (e) is accomplished via an electrically conductive adhesive and said chip-on-a-carrier is detachable from said PWB by a thermal process.

6. The method according to claim 1 , wherein said joining step (e) is accomplished in two steps comprising:

i) a first step wherein the joining is temporary and said chip-on-a-carrier is detachable from said printed wiring board after the first step; and

ii) based on the results of at least one test, a second step wherein the joining is made permanent by a subsequent process.

7. The method according to claim 6 , wherein said joining step (e) is accomplished via an electrically conductive adhesive comprising conductive particles and a resin curable in at least one stage, wherein:

a first step comprises a first stage cure and said chip-on-a-carrier is detachably joined to said printed wiring board; and

an optional second step comprises a final cure whereby said chip-on-a-carrier is durably joined to said printed wiring board.

8. The method according to claim 7 , wherein said resin comprises a blend of thermoplastic and thermoset resins, said first step comprises a low-temperature cure of said thermoplastic resin, and said second step comprises a final cure of said thermoset resin at a temperature greater than said low-temperature cure of said first step.

9. The method according to claim 7 , wherein said resin comprises a blend of UV-curable and thermoset resins, said first step comprises UV-curing said UV-curable resin, and said second step comprises a final cure of said thermoset resin by a thermal process.

10. The method according to claim 6 , wherein said joining step (e) is accomplished via a mixture of electrically conductive solder comprising conductive filler and a flowable solder in at least one stage, wherein:

i) a first step comprises a first stage low temperature reflow whereby said chip-on-a-carrier is detachably joined to said printed wiring board; and

ii) an optional second step comprises a high temperature reflow whereby said chip-on-a-carrier is durably joined to said printed wiring board.

11. The method according to claim 10 , wherein said solder mix comprises a blend of tin-bismuth and tin-lead solders, said first step comprises a low-temperature reflow of said tin-bismuth solder, and said second step comprises a high temperature reflow of said tin-lead solder at a temperature greater than said low-temperature reflow of said first step.

12. The method according to claim 6 , wherein said pads on said second surface of said decal are sculpted with protrusions, said pads on said printed wiring board have solder bumps, said first step comprises insertion of said sculpted pad into said solder bumps, and said second step comprises reflowing solder to wet said sculpted pad.

13. The method according to claim 6 , wherein said pads on said second surface of said flexible substrate are provided with dendritic protrusions, and said first step comprises insertion of said dendritic protrusions into said pads on said printed wiring board.

14. The method according to claim 6 , wherein said pads on said second surface of said flexible substrate and said pads on said printed wiring board are provided with dendritic protrusions and valleys, and said first step comprises insertion of said dendritic protrusions into the valleys of said opposing pads to thereby form a detachable interdigitating interconnection.

15. The method according to claim 1 , wherein said pads are finished from the group: Sn and Au.

16. The method according to claim 15 , wherein said attachment is made permanent by elevated temperature and pressure.