Integrated circuit packaging system with paddle molding and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a package paddle, the package paddle having a paddle external layer, and a pad adjacent the package paddle, the pad having pad external layer,

wherein the package paddle and the pad are connected via a connection portion, the connection portion forming a recess between the package paddle and the pad, and

wherein paddle external layer and the pad external layer are coplanar and separated by the recess:

forming a hole in the connection portion, wherein the hole extends therethrough the connection portion and into the recess;

mounting an integrated circuit to the package paddle;

forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;

attaching connectors directly on the integrated circuit, the lead, and the package paddle; and

forming an encapsulation covering the integrated circuit and within the hole and the recess.

2. The method as claimed in claim 1 wherein forming the hole includes forming the hole as a slot.

3. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation with at least had of the lead in the encapsulation.

4. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation with at least half of the pad in the encapsulation.

5. The method as claimed in claim 1 wherein providing the package paddle includes providing the package paddle having the paddle external layer surrounded by the pad external layer.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a package paddle, the package paddle having a paddle external layer, and a pad adjacent the package paddle, the pad having a pad external layer,

wherein the package paddle and the pad are connected via a connection portion, the connection portion forming a recess between the package paddle and the pad, and

wherein the paddle external layer and the pad external layer are coplanar and separated by the recess:

forming a hole in the connection portion, wherein the hole extends therethrough the connection portion and into the recess;

mounting an integrated circuit to the package paddle;

forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;

attaching a pad-device connector directly on the inter the package paddle;

attaching a lead-device connector directly on the integrated circuit and the lead; and

forming an encapsulation coving the integrated circuit and within the hole and the recess.

7. The method as claimed in claim 6 wherein forming the hole includes forming the hole as multiple slots.

8. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation with at least half of the lead having a conical shape in the encapsulation.

9. The method as claimed in claim 6 wherein for min the encapsulation includes forming the encapsulation with at least half of the pad having a conical shape in the encapsulation.

10. The method as claimed in claim 6 wherein:

providing the package paddle includes providing the package paddle having the paddle external layer surrounded by the pad external layer; and

forming the encapsulation includes the encapsulation coplanar with the pad external layer.

11. An integrated circuit packaging system comprising:

a package paddle having a paddle external layer,

a pad adjacent the package paddle, the pad having a pad external layer,

wherein the pad and the package paddle are connected via a connection portion, the connection portion configured to provide a recess between the pad and the package paddle, and

where the paddle external layer and the pad external layer are coplanar and separated recess:

a hole formed in the connection portion, wherein the hole extends therethrough the connection portion and into the recess:

an integrated circuit mounted to the package paddle;

a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle;

connectors directly on the integrated circuit, the lead, and the package paddle; and

an encapsulation covering the integrated circuit and within the hole and the recess.

12. The system as claimed in claim 11 wherein the hole is formed as a slot.

13. The system as claimed in claim 11 wherein the encapsulation is formed with at least half of the lead in the encapsulation.

14. The system as claimed in claim 11 wherein the encapsulation is formed with at least half of the pad in the encapsulation.

15. The system as claimed in claim 11 wherein the package paddle includes the paddle external layer surrounded by the pad external layer.

16. The system as claimed in claim 11 wherein the connectors includes:

a pad-device connector directly on the integrated circuit and the package paddle; and

a lead-device connector directly on the integrated circuit and the lead.

17. The system as claimed in claim 16 wherein the hole is formed as multiple slots.

18. The system as claimed in claim 16 wherein the encapsulation is formed with at least half of the lead having a conical shape in the encapsulation.

19. The system as claimed in claim 16 wherein the encapsulation is formed with at least half of the pad having a conical shape in the encapsulation.

20. The system as claimed in claim 16 wherein:

the paddle external layer is surrounded by the pad external layer; and

the encapsulation is coplanar with the pad external layer.