Integrated circuit packaging system with lead encapsulation and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a package paddle;
forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side, wherein forming the lead includes forming the lead having a lower step in the hole and an inner surface at a lower end of the hole;
attaching an attach layer to the package paddle;
mounting an integrated circuit over the package paddle with the attach layer attached to the integrated circuit;
connecting an electrical connector to the lead and the integrated circuit; and
forming a fill layer exposing a bottom surface of the lead ridge and within the hole.
2. The method as claimed in claim 1 wherein forming the fill layer includes forming a passivation layer within the hole.
3. A method of manufacture of an integrated circuit packaging system comprising:
forming a package paddle;
forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side, wherein forming the lead includes forming the lead having a lower step in the hole and an open lower end of the hole;
attaching an attach layer to the package paddle;
mounting an integrated circuit over the package paddle with the attach layer attached to the integrated circuit;
connecting an electrical connector to the lead and the integrated circuit; and
forming a fill layer exposing a bottom surface of the lead ridge and within the hole.
4. The method as claimed in claim 3 wherein forming the fill layer includes forming a passivation layer within the hole.
5. An integrated circuit packaging system comprising:
a package paddle;
a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side, wherein the lead includes a lower step in the hole and an inner surface at a lower end of the hole;
an attach layer attached to the package paddle;
an integrated circuit over the package paddle, wherein the integrated circuit is over the package paddle with the attach layer attached to the integrated circuit;
an electrical connector connected to the lead and the integrated circuit;
a fill layer exposing a bottom surface of the lead ridge and within the hole.
6. The system as claimed in claim 5 wherein the lead includes a conductive lead top layer with the hole therethrough.
7. The system as claimed in claim 5 wherein the fill layer is coplanar with a conductive lead bottom layer of the lead.
8. The system as claimed in claim 5 wherein the package paddle includes a paddle recess with the integrated circuit mounted within the paddle recess.
9. The system as claimed in claim 5 wherein the lead includes a conductive lead bottom layer and the hole at a bottom layer periphery of the conductive lead bottom layer.
10. The system as claimed in claim 5 wherein the fill layer is a passivation layer within the hole.
11. An integrated circuit packaging system comprising:
a package paddle;
a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side, wherein the lead includes a lower step in the hole and an open lower end of the hole
an attach layer attached to the package paddle;
an integrated circuit over the package paddle, wherein the integrated circuit is over the package paddle with the attach layer attached to the integrated circuit;
an electrical connector connected to the lead and the integrated circuit;
a fill layer exposing a bottom surface of the lead ridge and within the hole.
12. The system as claimed in claim 11 wherein the fill layer is a passivation layer within the hole.
13. The system as claimed in claim 11 wherein the lead includes a conductive lead top layer with the hole therethrough.
14. The system as claimed in claim 11 wherein the fill layer is coplanar with a conductive lead bottom layer of the lead.
15. The system as claimed in claim 11 wherein the package paddle includes a paddle recess with the integrated circuit mounted within the paddle recess.
16. The system as claimed in claim 11 wherein the lead includes a conductive lead bottom layer and the hole at a bottom layer periphery of the conductive lead bottom layer.