Encapsulant interposer system with integrated passive devices and manufacturing method therefor
View Patent ↗A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
1. A semiconductor package system comprising:
an encapsulant interposer having a passive device encapsulated, the passive device including a first inductor partially encircled by a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments;
a first die connected to the encapsulant interposer; and
a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer.
2. The system as claimed in claim 1 wherein the encapsulant interposer having the passive device encapsulated has only one of the top or the bottom surface of the passive device exposed.
3. The system as claimed in claim 1 wherein the encapsulant interposer having the passive device encapsulated has neither of the top or the bottom surface of the passive device exposed.
4. The system as claimed in claim 1 wherein the encapsulant interposer having the passive device encapsulated has a connect bar bent to a predetermined shape.
5. The system as claimed in claim 1 further comprising:
a package mold compound encapsulating the encapsulant interposer, the first die, and the second die.
6. The system as claimed in claim 5 wherein the first die is electrically connected to the substrate interposer through a bonding wire.
7. The system as claimed in claim 5 wherein the package mold compound has a package mold compound opening, exposing the top surface of the encapsulant interposer.
8. The system as claimed in claim 5 wherein the first die is a first type flip chip die.
9. The system as claimed in claim 5 wherein the first die is a second type flip chip die.
10. A method of manufacturing for a semiconductor package system comprising:
forming a leadframe having a passive device, the passive device including a first inductor partially encircling a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments;
encapsulating the passive device to form an encapsulant interposer;
attaching a first die to the encapsulant interposer;
forming a substrate interposer having a second die; and
stacking the encapsulant interposer over the substrate interposer.
11. The method as claimed in claim 10 wherein:
forming the leadframe includes forming a contact pad and a second dam bar;
encapsulating the passive device includes encapsulating the contact pad; and further comprising:
singulating the leadframe to eliminate the second dam bar.
12. The method as claimed in claim 10 wherein:
forming the leadframe includes forming an external contact terminal connected to the passive device, and further comprising:
bending the external contact terminal to a predetermined shape.
13. The method as claimed in claim 10 wherein forming the leadframe includes forming the leadframe having one or more than one row of a contact pad.
14. The method as claimed in claim 10 wherein forming the leadframe includes forming the leadframe having three inductors as the passive device.
15. A method of manufacturing for a semiconductor package system comprising:
forming a leadframe having a passive device, the passive device including a first inductor partially encircling a second inductor, with the first inductor parallel to the second inductor on at least four sides and each having at least three corner segments;
encapsulating the passive device to form an encapsulant interposer,
attaching a first die to the encapsulant interposer;
forming a substrate interposer having a second die;
stacking the encapsulant interposer over the substrate interposer; and
encapsulating the encapsulant interposer, the first die, and the second die in a package mold compound.
16. The method as claimed in claim 15 wherein forming the leadframe includes forming the first inductor and the second inductor connected to an external contact terminal.
17. The method as claimed in claim 15 wherein forming the leadframe includes forming the first inductor, the second inductor, and a third inductor.
18. The method as claimed in claim 15 wherein forming the leadframe includes forming a jumper wire connecting the first inductor to the second inductor.
19. The method as claimed in claim 15 wherein forming the leadframe includes forming a selected number of an external contact terminal bent to a predetermined shape.