Integrated circuit packaging system with multi-row leads and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a base structure having an intermediate lead with an intermediate concave side and an intermediate convex side, a peripheral lead with a peripheral concave side and a peripheral convex side, and a paddle with a paddle concave side and a paddle convex side; applying an inner multi-layer finish directly on the intermediate concave side, the peripheral concave side, and the paddle concave side; applying an outer multi-layer finish directly on the intermediate convex side, the peripheral convex side, and the paddle convex side; mounting an integrated circuit device over the inner multi-layer finish; attaching an interconnect directly to the inner multi-layer finish on the peripheral concave side and directly to integrated circuit device; and applying an encapsulation over the integrated circuit device, the interconnect, and the base structure, with the outer multi-layer finish exposed from the encapsulation.
1. An integrated circuit packaging system comprising:
a base structure having an intermediate lead with an intermediate concave side and an intermediate convex side, a peripheral lead with a peripheral concave side and a peripheral convex side, and a paddle with a paddle concave side and a paddle convex side;
an inner multi-layer finish directly on the intermediate concave side, the peripheral concave side, and the paddle concave side;
an outer multi-layer finish directly on the intermediate convex side, the peripheral convex side, and the paddle convex side;
an integrated circuit device over the inner multi-layer finish;
an interconnect attached directly to the inner multi-layer finish on the peripheral concave side and directly to integrated circuit device; and
an encapsulation over the integrated circuit device, the interconnect, and the base structure, with the outer multi-layer finish exposed from the encapsulation.
2. The system as claimed in claim 1 wherein the base structure includes a groove formed from edges of the intermediate lead, the peripheral lead, and the paddle.
3. The system as claimed in claim 1 wherein the base structure includes a punch depth less than a thickness of the integrated circuit device.
4. The system as claimed in claim 1 wherein the interconnect includes a section of the interconnect supported by a peripheral tapered edge of the peripheral lead.
5. The system as claimed in claim 1 further comprising a corner panel at a corner of the base structure.
6. The system as claimed in claim 1 further comprising a second interconnect attached directly to the inner multi-layer finish on the intermediate concave side and directly to the integrated circuit device.
7. The system as claimed in claim 6 wherein the base structure includes a groove formed from edges of the intermediate lead, the peripheral lead, and the paddle to expose the encapsulation.
8. The system as claimed in claim 6 wherein the base structure includes a punch depth equal to a thickness of the integrated circuit device.
9. The system as claimed in claim 6 wherein the second interconnect includes a section of the second-the interconnect supported by a lead tapered edge of the intermediate lead.
10. The system as claimed in claim 6 further comprising a corner panel at a corner of the base structure, the encapsulation intersected by the corner panel.