Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
View Patent ↗An electronic structure may include a conductive pad on a substrate, and an insulating layer on the substrate and on the conductive pad. The insulating layer may have a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer. A conductive layer comprising copper may be on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, and the conductive layer comprising copper may have a thickness of at least approximately 1.0 μm. A conductive barrier layer may be on the conductive layer comprising copper, and the conductive barrier layer may include at least one of nickel, platinum, palladium, and/or combinations thereof. A solder layer may be on the conductive barrier layer, the conductive layer comprising copper and the solder layer may comprise different materials, and the conductive barrier layer may be between the conductive layer comprising copper and the solder layer.
1. An electronic structure comprising:
a conductive pad on a substrate;
an insulating layer on the substrate and on the conductive pad, the insulating layer having a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer;
a conductive layer comprising copper on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, wherein the conductive layer comprising copper has a thickness of at least approximately 1.0 μm;
a conductive barrier layer on the conductive layer comprising copper wherein the conductive barrier layer comprises at least one of nickel, platinum, palladium, and/or combinations thereof;
a solder layer on the conductive barrier layer, wherein the conductive layer comprising copper and the solder layer comprise different materials and wherein the conductive barrier layer is between the conductive layer comprising copper and the solder layer;
a primary conductive trace on the substrate so that the primary conductive trace is between the substrate and the insulating layer; and
an electrical coupling between the primary conductive trace and the conductive pad, the electrical coupling providing at least two separate current flow paths between the primary conductive trace and the conductive pad.
2. An electronic structure according claim 1 wherein the conductive layer comprising copper has a thickness of approximately 5.0 μm.
3. An electronic structure according to claim 1 further comprising:
a seed layer between the conductive layer and the conductive pad and between the conductive layer and the insulating layer.
4. An electronic structure according to claim 3 wherein the seed layer comprises an adhesion layer of a material different than that of the conductive layer.
5. An electronic structure according to claim 4 wherein the adhesion layer comprises titanium, tungsten, chrome, and/or combinations thereof.
6. An electronic structure according to claim 4 wherein the seed layer comprises a plating conduction layer on the adhesion layer opposite the substrate, wherein the plating conduction layer and the conductive layer comprise a common material.
7. An electronic structure according to claim 3 wherein the conductive layer, the conductive barrier layer, and the solder layer are on portions of the seed layer, and wherein portions of the seed layer are free of the conductive layer, the conductive barrier layer, and the solder layer.
8. An electronic structure according to claim 1 wherein the conductive layer has a thickness in the range of approximately 1.0 μm to 5.0 μm.
9. An electronic structure comprising:
a conductive pad on a substrate;
an insulating layer on the substrate and on the conductive pad, the insulating layer having a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer;
a seed layer on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on a surface of the insulating layer opposite the substrate;
a conductive layer comprising copper on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, wherein the conductive layer comprising copper has a thickness of at least approximately 0.5 μm and wherein the seed layer is between the conductive layer comprising copper and the insulating layer and between the conductive layer comprising copper and the conductive pad;
a conductive barrier layer on the conductive layer comprising copper wherein the conductive barrier layer comprises at least one of nickel, platinum, palladium, and/or combinations thereof;
a solder layer on the conductive barrier layer wherein the conductive layer comprising copper and the solder layer comprise different materials, wherein the conductive barrier layer is between the conductive layer comprising copper and the solder layer, wherein the conductive layer comprising copper, the conductive barrier layer, and the solder layer are on portions of the seed layer, and wherein portions of the seed layer are free of the conductive layer comprising copper, the conductive barrier layer, and the solder layer;
a primary conductive trace on the substrate so that the primary conductive trace is between the substrate and the insulating layer; and
an electrical coupling between the primary conductive trace and the conductive pad, the electrical coupling providing at least two separate current flow paths between the primary conductive trace and the conductive pad.
10. An electronic structure according claim 9 wherein the conductive layer comprising copper has a thickness of approximately 5.0 μm.
11. An electronic structure according to claim 9 wherein the solder layer has a rounded surface opposite the conductive layer having the thickness of at least approximately 0.5 μm.
12. An electronic structure according to claim 9 wherein the conductive layer has a thickness in the range of approximately 1.0 μm to 5.0 μm.
13. An electronic structure according to claim 9
wherein the solder layer and the barrier layer comprise different materials.
14. An electronic structure according to claim 9 wherein the seed layer comprises an adhesion layer of a material different than that of the conductive layer.
15. An electronic structure according to claim 14 wherein the adhesion layer comprises titanium, tungsten, chrome, and/or combinations thereof.
16. An electronic structure according to claim 14 wherein the seed layer comprises a plating conduction layer on the adhesion layer opposite the substrate, wherein the plating conduction layer and the conductive layer comprise a common material.
17. An electronic structure according to claim 9 wherein the conductive layer has a thickness of at least approximately 1.0 μm.