Method for chemical mechanical planarization of a copper-containing substrate
View Patent ↗A method using an associated composition for chemical mechanical planarization of a copper-containing substrate affords high copper removal rates and low dishing values during CMP processing of the copper-containing substrate, including an abrasive, at least three surfactants, preferably non-ionic and preferably three distinct surfactants, preferably in the range of 100 ppm to 2000 ppm per surfactant and an oxidizing agent.
1. A method for chemical mechanical planarization of a surface having at least one feature thereon comprising copper, said method comprising the steps of:
A) placing a substrate having the surface having the at least one feature thereon comprising copper in contact with a polishing pad;
B) delivering a polishing composition comprising:
a) an abrasive;
b) at least three surfactants; and
c) an oxidizing agent;
wherein one of the at least three surfactants is nonylphenol novolac ethoxylate presented at a level ranging from 100 ppm to 2000 ppm;
and
C) polishing the substrate with the composition.
2. The method of claim 1 wherein the at least three surfactants are nonionic surfactants.
3. The method of claim 1 , wherein the three different surfactants are ethylene oxide condensate, polyoxyethylene monolaurate, and nonylphenol novolac ethoxylate.
4. The method of claim 1 , wherein the three different surfactants are glycolic acid ethoxylate-4-tert-butylphenyl ether, nonylphenol novolac ethoxylate, and salicyldoxime.
5. The method of claim 1 , wherein the three different surfactants are salicyldoxime, polyoxyethylene monolaurate, and nonylphenol novolac ethoxylate.
6. The method of claim 1 , wherein the three different surfactants are glycolic acid ethoxylate lauryl ether, nonylphenol novolac ethoxylate, and salicyldoxime.
7. The method of claim 1 , wherein the three different surfactants are glycyl glycine, nonylphenol novolac ethoxylate, and salicyldoxime.
8. The method of claim 1 wherein other two surfactants are selected from the group consisting of glycolic acid ethoxylate-4-tert-butylphenyl ether, glycolic acid ethoxylate lauryl ether, glycyl glycine, polyoxyethylene monolaurate and salicyldoxime.
9. A chemical mechanical planarization composition comprising:
a) an abrasive;
b) at least three surfactants; and
c) an oxidizing agent;
wherein one of the at least three surfactants is nonylphenol novolac ethoxylate presented at a level ranging from 100 ppm to 2000 ppm.
10. The chemical mechanical planarization composition of claim 9 wherein the at least three surfactants are nonionic surfactants.
11. The chemical mechanical planarization composition of claim 9 , wherein other two surfactants are selected from the group consisting of glycolic acid ethoxylate-4-tert-butylphenyl ether, glycolic acid ethoxylate lauryl ether, glycyl glycine, polyoxyethylene monolaurate and salicyldoxime.
12. The chemical mechanical planarization composition of claim 9 , wherein the at least three surfactants are ethylene oxide condensate, polyoxyethylene monolaurate, and nonylphenol novolac ethoxylate.
13. The chemical mechanical planarization composition of claim 9 , wherein the at least three surfactants are glycolic acid ethoxylate-4-tert-butylphenyl ether, nonylphenol novolac ethoxylate, and salicyldoxime.
14. The chemical mechanical planarization composition of claim 9 , wherein the at least three surfactants are salicyldoxime, polyoxyethylene monolaurate, and nonylphenol novolac ethoxylate.
15. The chemical mechanical planarization composition of claim 9 , wherein the at least three surfactants are glycolic acid ethoxylate lauryl ether, nonylphenol novolac ethoxylate, and salicyldoxime.
16. A chemical mechanical planarization composition comprising:
a) an abrasive;
b) at least three nonionic surfactants; and
c) an oxidizing agent
wherein one of the at least three nonionic surfactants is nonylphenol novolac ethoxylate presented at a level ranging from 100 ppm to 2000 ppm.
17. The chemical mechanical planarization composition of claim 16 , wherein other two surfactants are selected from the group consisting of glycolic acid ethoxylate-4-tert-butylphenyl ether, glycolic acid ethoxylate lauryl ether, glycyl glycine, polyoxyethylene monolaurate and salicyldoxime.