Method for chemical mechanical planarization of a tungsten-containing substrate
View Patent ↗The titled method affords low dishing levels in the polished substrate while simultaneously affording high metal removal rates. The method utilizes an associated polishing composition. Components in the composition include a poly(alkyleneimine) such as polyethyleneimine, an abrasive, an acid, and an oxidizing agent, such as a per-compound.
1. A method of chemical mechanical polishing of a substrate comprising tungsten, said method comprising: movably contacting a surface of the substrate with a) an abrasive, and b) a liquid component consisting essentially of water, an acid sufficient to provide a pH of 2 to 5, a per-type oxidizer, between 1 ppm and 100 ppm of an iron compound which induces free radical formation from the per-type oxidizer to increase tungsten removal rates, and between 0.1 and 10 ppm of a poly(alkyleneimine), wherein the liquid component is substantially free of carboxylic acids, and wherein the polishing removes greater than 2000 angstroms per minute of tungsten at 3 psi downforce.
2. The method of claim 1 wherein the poly(alkyleneimine) is a polymer or oligomer of ethyleneimine.
3. The method of claim 2 wherein the poly(alkyleneimine) has a molecular weight from about 10000 to over 140000.
4. The method of claim 2 wherein the liquid component is substantially free of chelating compounds.
5. The method of claim 2 wherein the polishing removes greater than 4000 angstroms per minute of tungsten at 3 psi downforce.
6. The method of claim 2 wherein the substrate further comprises a dielectric material, wherein the polishing removes less than 400 angstroms per minute of dielectric material at 3 psi downforce.
7. The method of claim 2 wherein the substrate further comprises polysilicon, wherein the polishing removes less than 400 angstroms per minute of polysilicon at 3 psi downforce.
8. The method of claim 2 wherein the pH of the liquid component is between 2.5 to 4.
9. The method of claim 2 wherein the abrasive comprises a first silica abrasive having an average diameter of between 30 and 90 nm and having said iron bound to a surface thereof, said iron being able to induce free radical formation in a per-type oxidizer to increase tungsten removal rates; and further comprising a second silica abrasive having an average diameter of between 120 and 240 nm, wherein the weight percent of the second abrasive is between 0.5 and 1.5 times the weight percent of the first abrasive.
10. The method of claim 1 wherein the liquid component is substantially free of fluoride-containing compounds.
11. The method of claim 1 wherein the poly(alkyleneimine) is a polyethyleneimine and is present in an amount below 6 ppm.
12. The method of claim 1 wherein the abrasive comprises silica in an amount between 0.1% to 5% by weight compared to the weight of the abrasive and the liquid component, and wherein the liquid component contains water, H 2 O 2 in an amount from 0.5% to 4%, between 1 ppm and 100 ppm of an iron compound which induces free radical formation from the per-type oxidizer to increase tungsten removal rates, and between 0.1 and 6 ppm of a polyethyleneimine.
13. A method of chemical mechanical polishing of a substrate comprising tungsten, said method comprising: movably contacting a surface having tungsten thereon with a) an abrasive suspended in a liquid to form a slurry, said slurry abrasive ranging between 0.3 and 1% by weight, said liquid consisting essentially of water, an acid sufficient to provide a pH of 2 to 5, a per-type oxidizer, and between 0.1 and 10 ppm of a poly(alkyleneimine), said liquid being substantially free of fluoride-containing compounds, wherein the polishing removes greater than 2000 angstroms per minute of tungsten.
14. The method of claim 13 wherein the polishing removes greater than 4000 angstroms per minute of tungsten at 3 psi downforce.
15. The method of claim 13 wherein the poly(alkyleneimine) is a branched polyethyleneimine and is present in an amount below 6 ppm.
16. The method of claim 13 wherein the substrate further comprises a dielectric material, wherein the polishing removes less than 400 angstroms per minute of dielectric material at 3 psi downforce.
17. The method of claim 13 wherein the substrate further comprises polysilicon, wherein the polishing removes less than 400 angstroms per minute of polysilicon at 3 psi downforce.
18. The method of claim 13 wherein the pH of the liquid component is between 2.5 to 4.
19. A method of chemical mechanical polishing of a substrate comprising tungsten, said method comprising: movably contacting a surface of the substrate with a) an abrasive, and b) a liquid component consisting essentially of water, an acid sufficient to provide a pH of 2 to 5, a per-type oxidizer, between 1 ppm and 60 ppm of an iron compound which induces free radical formation from the per-type oxidizer to increase tungsten removal rates, and between 0.1 and 10 ppm of a poly(alkyleneimine), and wherein the polishing removes greater than 2000 angstroms per minute of tungsten.
20. The method of claim 19 wherein the poly(alkyleneimine) comprises polyethyleneimine present in an amount between 1 and 4 ppm.