Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.
1. A method of manufacture of an
integrated circuit packaging system comprising:
forming a leadframe including leads and a paddle;
molding a first encapsulant in the leadframe between the leads and the paddle, the first
encapsulant thinner than the leads;
forming a non-conductive layer over the paddle; and
forming conductive traces each having a side, the side directly on the lead, the first
encapsulant, and the non-conductive layer.
2. The method as claimed in claim 1 further comprising:
attaching a first module to the conductive traces; and
encapsulating the first module in a second encapsulant.
3. The method as claimed in claim 1 wherein:
forming the non-conductive layer forms the non-conductive layer with an opening therein over a portion of the paddle; and
further comprising:
conductively bonding a first module to the conductive traces on the non-conductive layer and to the paddle through the opening in the non-conductive layer.
4. The method as claimed in claim 1 further comprising:
conductively bonding a first module to the conductive traces;
attaching a second module to the first module;
conductively bonding the second module to the leads; and
further encapsulating the first module and the second module in a second encapsulant.
5. The method as claimed in claim 1 further comprising:
conductively bonding a first module to the conductive traces;
attaching a second module to the first module, the second module having a substrate conductively connected to the leads;
further encapsulating the second module in a configured encapsulant exposing an exposed portion of the substrate; and
conductively bonding a third module to the exposed portion of the substrate.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a leadframe including leads and a paddle;
molding a first encapsulant in the leadframe between the leads and the paddle, the first encapsulant coplanar with the top and bottom surfaces of the paddle;
forming a non-conductive layer over the paddle;
forming straight or bent conductive traces each having a side, the side directly on the lead, the first encapsulant, and the non-conductive layer; and
separating the leads from each other.
7. The method as claimed in claim 6 further comprising:
conductively bonding a flip chip module to the conductive traces; and
further encapsulating the flip chip module in a second encapsulant.
8. The method as claimed in claim 6 wherein:
forming the non-conductive layer forms the non-conductive layer with an opening therein over a portion of the paddle; and
further comprising:
conductively bonding a flip chip module to the conductive traces on the non-conductive layer and to the paddle through the opening in the non-conductive layer.
9. The method as claimed in claim 6 further comprising:
conductively bonding a flip chip module to the conductive traces;
attaching a wire bond module to the flip chip module;
wire bonding the wire bond module to the leads; and
further encapsulating the flip chip module and the wire bond module in a second encapsulant.
10. The method as claimed in claim 6 further comprising:
conductively bonding a flip chip module to the conductive traces;
attaching a wire bond module to the flip chip module, the wire bond module having a substrate conductively connected to the leads;
encapsulating the wire bond module in a configured encapsulant exposing an exposed portion of the substrate; and
bonding a further flip chip module to the exposed portion of the substrate.
11. An integrated circuit packaging system comprising:
leads
a paddle;
a first encapsulant molded between the leads and the paddle, the first encapsulant
thinner than the leads;
a non-conductive layer over the paddle; and
conductive traces each having a side, the side directly on the lead, the first encapsulant, and the non-conductive layer.
12. The system as claimed in claim 11 further comprising:
a first module attached to the conductive traces; and
a second encapsulant encapsulating the first module.
13. The system as claimed in claim 11 wherein:
the non-conductive layer has an opening therein over a portion of the paddle; and
further comprising:
a first module conductively bonded to the conductive traces on the non-conductive layer and to the paddle through the opening in the non-conductive layer.
14. The system as claimed in claim 11 further comprising:
a first module conductively bonded to the conductive traces;
a second module attached to the first module;
bonds conductively bonding the second module to the leads; and
a second encapsulant encapsulating the first module and the second module.
15. The system as claimed in claim 11 further comprising:
a first module conductively bonded to the conductive traces;
a second module attached to the first module, the second module having a substrate conductively connected to the leads;
a configured encapsulant encapsulating the second module and exposing an exposed portion of the substrate; and
third module conductively bonded to the exposed portion of the substrate.
16. The system as claimed in claim 11 wherein:
the first encapsulant is coplanar with the top and bottom surfaces of the paddle; and
the conductive traces are straight or bent on the first encapsulant or the non-conductive layer.
17. The system as claimed in claim 16 further comprising:
a flip chip module conductively bonded to the conductive traces; and
a second encapsulant encapsulating the flip chip module.
18. The system as claimed in claim 16 wherein:
the non-conductive layer has an opening therein over a portion of the paddle; and
further comprising
a flip chip module conductively bonded to the conductive traces on the non-conductive layer and to the paddle through the opening in the non-conductive layer.
19. The system as claimed in claim 16 further comprising:
a flip chip module conductively bonded to the conductive traces;
a wire bond module attached to the flip chip module;
bond wires conductively connecting the wire bond module to the leads; and
a second encapsulant encapsulating the wire bond module and the flip chip module.
20. The system as claimed in claim 16 further comprising:
a flip chip module attached to the conductive traces;
a wire bond module attached to the flip chip module and having a substrate conductively connected to the leads;
a configured encapsulant encapsulating the wire bond module and exposing a portion of the substrate; and
a further flip chip module bonded to the exposed portion of the substrate.