Method of assembling shielded integrated circuit device
View Patent ↗A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.
1. An integrated circuit (IC) device, comprising:
a lead frame or substrate panel;
a semiconductor die attached and electrically coupled to the lead frame or substrate panel;
a shield disposed between the bottom surface of the semiconductor die and the lead frame or substrate panel, wherein the shield comprises a magnetic foil;
a first encapsulant that covers at least a top and two side surfaces of the semiconductor die; and
a second encapsulant that covers at least a top and two side surfaces of the first encapsulant, wherein said second encapsulant includes a material that provides an electromagnetic shielding function.
2. The IC device of claim 1 , wherein the second encapsulant includes conductive material and metal particles for providing electric shielding for the IC device.
3. The IC device of claim 1 , wherein the second encapsulant includes non-conductive magnetic particles for providing magnetic shielding for the IC device.
4. The IC device of claim 1 , wherein the shield comprises a metal applied to a back side of the semiconductor die before the semiconductor die is attached to the lead frame or substrate panel.
5. A method of assembling an integrated circuit (IC) device including the steps of:
providing a lead frame or substrate panel;
attaching a semiconductor die to the lead frame or substrate panel, including shielding a bottom surface of the semiconductor die from the lead frame or substrate panel, wherein the shielding step includes disposing a metal foil between the bottom surface of the semiconductor die and the lead frame or substrate panel;
electrically coupling the semiconductor die to the lead frame or substrate panel;
encapsulating the semiconductor die with a first encapsulant, wherein the first encapsulant covers at least a top and two side surfaces of the semiconductor die; and
encapsulating the first encapsulant with a second encapsulant wherein the second encapsulant includes a material that provides an electromagnetic shielding function, and wherein the second encapsulant covers at least a top and two side surfaces of the first encapsulant.
6. The method of assembling an IC device of claim 5 , wherein the second encapsulant includes conductive material and metal particles for providing electric shielding for said IC device.
7. The method of assembling an IC device of claim 5 , wherein the second encapsulant includes non-conductive magnetic particles for providing magnetic shielding for said IC device.
8. The method of assembling an IC device of claim 5 , wherein the first encapsulant does not provide a magnetic shielding function.
9. The method of assembling an IC device of claim 5 , wherein the step of electrically coupling to the lead frame or substrate is performed by wire bonding.
10. The method of assembling an IC device of claim 5 , wherein the step of electrically coupling to the lead frame or substrate is performed by a flip chip process.
11. The method of assembling an IC device of claim 5 , wherein the first and second encapsulants are applied by means of MAP molding processes.
12. The method of assembling an IC device of claim 5 , wherein the first and second encapsulants are applied by means of mold tools, each mold tool including an individual cavity for each mold cap.