Integrated circuit packaging system with pad connection and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a first top distribution layer on the peripheral lead top side, the first top distribution layer having a first top terminal; connecting an integrated circuit to the first top distribution layer, the integrated circuit having a central portion directly over a plurality of the first top terminal; and applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side;
forming a first top distribution layer on the peripheral lead top side, the first top distribution layer having a first top terminal;
connecting an integrated circuit to the first top distribution layer, the integrated circuit having a central portion directly over a plurality of the first top terminal; and
applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge.
2. The method as claimed in claim 1 wherein forming the peripheral lead includes forming the peripheral lead having the peripheral lead conductive plate with a recess at the peripheral lead bottom side.
3. The method as claimed in claim 1 further comprising forming a conductive cap directly on the peripheral lead top side.
4. The method as claimed in claim 1 wherein forming the peripheral lead includes forming the peripheral lead having a peripheral lead step portion protruding from the peripheral lead top side.
5. The method as claimed in claim 1 further comprising forming a central lead directly under the integrated circuit.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side;
forming a first top distribution layer on the peripheral lead top side;
connecting an integrated circuit to the first top distribution layer, the integrated circuit having a central portion directly over a plurality of a first top terminal;
forming an encapsulation over the integrated circuit and the first top distribution layer; and
applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge.
7. The method as claimed in claim 6 wherein forming the peripheral lead includes forming the peripheral lead having the peripheral lead conductive plate with a recess at the peripheral lead bottom side and with a lead plate conductive material.
8. The method as claimed in claim 6 further comprising:
forming a conductive cap directly on the peripheral lead top side; and
wherein:
forming the first top distribution layer includes forming the first top distribution layer directly on the conductive cap and having a distribution layer conductive material.
9. The method as claimed in claim 6 wherein:
forming the peripheral lead includes forming the peripheral lead having a peripheral lead step portion protruding from the peripheral lead top side; and
wherein:
forming the first top distribution layer includes forming the first top distribution layer having a peripheral distribution step portion directly on the peripheral lead step portion.
10. The method as claimed in claim 6 further comprising forming a central lead directly under the integrated circuit and adjacent the peripheral lead.