Composition for improving dryness during wire sawing

1. A method of slicing a substrate, which method comprises:

(i) contacting the substrate with a composition comprising:

(a) a liquid carrier comprising at least about 50 wt. % water and about 0.1 wt. % to about 20 wt. % of a polyol, based on the weight of the liquid carrier;

(b) about 30 wt. % to about 60 wt. % of an abrasive suspended in the liquid carrier; and

(c) about 0.2 wt. % to about 10 wt. % of a thickener, wherein the thickener is a cellulose compound;

(ii) contacting the substrate and the composition with a wire saw, and

(iii) moving the wire saw, with the composition in contact therewith, relative to the substrate so as to abrade at least a portion of the substrate to slice the substrate.

2. The method of claim 1 , wherein the polyol is glycerol, polyethylene glycol, 1,6-hexanediol, pentaerythrite, or a combination thereof.

3. The method of claim 1 , wherein the polyol has a carbon chain of four or more carbons.

4. The method of claim 1 , wherein the polyol has a carbon atom to oxygen atom ratio of at least about 2.5:1.

5. The method of claim 1 , wherein the composition further comprises an oxidizing agent.

6. The method of claim 1 , wherein the composition further comprises calcium chloride, ammonium sulfate, aluminum nitrate, or combinations thereof.