Method for manufacturing integrated circuit package system with under paddle leadfingers
View Patent ↗A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
1. A method for manufacturing an integrated circuit package system comprising:
forming a die paddle;
forming an under paddle leadframe including lower leadfingers thereon;
attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle;
attaching a die to the die paddle; and
planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
2. The method as claimed in claim 1 further comprising forming the lower leadfingers to have the top surfaces of the lower leadfingers to be coplanar with the top or bottom surface of the die paddle.
3. The method as claimed in claim 1 further comprising separating the lower leadfingers, lead pads, and paddle tie bars using a linear or selective cutting process.
4. The method as claimed in claim 1 further comprising forming the lower leadfingers to extend different distances under the die paddle.
5. The method as claimed in claim 1 wherein:
forming the die paddle includes forming the die paddle with paddle tie bars;
forming the under paddle leadframe includes forming the under paddle leadframe with frame tie bars; and
attaching the die paddle to the under paddle leadframe includes attaching the paddle tie bars to the frame tie bars.
6. A method for manufacturing an integrated circuit package system comprising:
forming a die paddle with leadfingers thereon;
forming an under paddle leadframe including lower leadfingers and lead pads thereon;
attaching the under paddle leadframe to the die paddle with the lower leadfingers and the lead pads extending under the die paddle;
attaching a die to the die paddle;
bonding wires among the die, the leadfingers and the lead pads;
encapsulating the bond wires, the die, and the under paddle leadframe; and
planarizing a bottom surface of the encapsulant and the under paddle leadframe to separate the lower leadfingers and the lead pads under the die paddle.
7. The method as claimed in claim 6 further comprising:
forming the lower leadfingers to have the top surfaces of the lower leadfingers to be coplanar with the top or bottom surface of the die paddle; and
forming the bottom surfaces of the leadfingers to be coplanar with the bottom surfaces of the lead pads.
8. The method as claimed in claim 6 further comprising:
forming the lower leadfingers, the lead pads, and paddle tie bars from the under paddle leadframe by grinding, sawing, laser cutting, or etching.
9. The method as claimed in claim 6 further comprising forming the lower leadfingers to extend the lead pads different distances under the die paddle.
10. The method as claimed in claim 6 wherein:
forming the die paddle includes forming the die paddle with paddle tie bars;
forming the under paddle leadframe includes forming the under paddle leadframe with frame tie bars having bent portions; and
attaching the die paddle to the under paddle leadframe includes riveting the paddle tie bars to the frame tie bars.