Semiconductor device including an asymmetric feature, and method of making the same

1. A method of making a semiconductor device, the method comprising:

forming a first gate on a substrate;

forming first and second diffusion regions in the substrate on a side of the first gate;

forming first and second contacts which contact the first and second diffusion regions, respectively, the first contact being asymmetric with respect to the second contact, and the first diffusion region comprising a width which is greater than a width of the second diffusion region;

forming a first FET comprising the first and second diffusion regions, first gate and first and second contacts;

forming a second FET on the substrate adjacent to the first FET and including a second gate formed on the substrate, third and fourth diffusion regions formed in the substrate on a side of the second gate, and third and fourth contacts which contact the third and fourth diffusion regions, respectively; and

forming a third FET on the substrate adjacent to the second FET, the third FET including a third gate formed on the substrate, fifth and sixth diffusion regions formed in the substrate on a side of the third gate, and fifth and sixth contacts which contact the fifth and sixth diffusion regions, respectively,

wherein a pitch between the first and second gates comprises a first pitch and a pitch between the second and third gates comprises a second pitch which is different from the first pitch.

2. The method of making a semiconductor device of claim 1 , wherein the asymmetry of the first and second contacts comprises one of:

the first contact is located a first distance from the first gate, and the second contact is located a second distance from the first gate, the second distance being different than the first distance;

the first contact comprises a first volume, and the second contact comprises a second volume, the second volume being different than the first volume;

the first contact comprises a first material, and the second contact comprises a second material, the second material being different than the first material; and

the first contact comprises one of a stressed and unstressed contact, and the second contact comprises the other one of the stressed and unstressed contact.

3. The method of making a semiconductor device of claim 1 , wherein the first pitch is at least two times the second pitch.

4. The method of making a semiconductor device of claim 1 , wherein the forming of the first gate comprises using a mask which lithographically defines the first gate on the substrate.

5. The method of making a semiconductor device of claim 4 , wherein the mask lithographically defines a second gate adjacent to the first gate on the substrate, and a third gate adjacent to the second gate on the substrate, such that the pitch between the first and second gates comprises the first pitch and the pitch between the second and third gates comprises the second pitch which is different from the first pitch.

6. The method of making a semiconductor device of claim 4 , wherein the mask lithographically defines a second gate adjacent to the first gate on the substrate, such that the second gate has a channel length which is less than a channel length of the first gate.

7. The method of claim 1 , wherein the first diffusion region comprises a source region and the second diffusion region comprises a drain region.

8. The method of claim 1 , wherein the width of the first diffusion region is at least twice the width of the second diffusion region.

9. The method of claim 1 , wherein the asymmetry of the first and second contacts comprises the first contact being located a first distance from the first gate, and the second contact being located a second distance from the first gate, the second distance being different than the first distance.

10. The method of claim 1 , wherein the asymmetry of the first and second contacts comprises the first contact including a first volume, and the second contact including a second volume, the second volume being different than the first volume.

11. The method of claim 1 , wherein the asymmetry of the first and second contacts comprises the first contact comprising a first material and the second contact comprising a second material, the second material being different than the first material.

12. The method of claim 1 , wherein the asymmetry of the first and second contacts comprises the first contact including one of a stressed and unstressed contact, and the second contact including the other one of the stressed and unstressed contact.

13. A method of making a semiconductor device, the method comprising:

forming a first gate on a substrate;

forming first and second diffusion regions in the substrate on a side of the first gate; and

forming first and second contacts which contact the first and second diffusion regions, respectively, the first contact being asymmetric with respect to the second contact, and the first diffusion region comprising a width which is greater than a width of the second diffusion region,

wherein the forming of the first gate comprises using a mask which lithographically defines the first gate on the substrate,

wherein the mask lithographically defines a plurality of gates including a second gate adjacent to the first gate on the substrate, and a third gate adjacent to the second gate on the substrate, and an intermediate gate between the first and second gates on the substrate, a pitch between the plurality of gates comprising the same pitch, and

wherein the method further comprises:

removing the intermediate gate such that a pitch between the first and second gates comprises a first pitch and a pitch between the second and third gates comprises a second pitch which is different from the first pitch.

14. The method of making a semiconductor device of claim 13 , wherein the removing of the intermediate gate comprises performing a cut mask process to remove the intermediate gate.

15. The method of making a semiconductor device of claim 14 , wherein the forming of the first and second diffusion regions comprises performing a halo implant after the performing of the cut mask process.

16. A method of making a semiconductor device, the method comprising:

forming first, second and third field effect transistors (FETs) on a substrate, the first, second and third FETs including first, second and third gates, respectively, such that a pitch between the first and second gates comprises a first pitch and a pitch between the second and third gates comprises a second pitch which is different than the first pitch, by one of:

a first process of using a mask to lithographically define the second gate adjacent to the first gate on the substrate, and the third gate adjacent to the second gate on the substrate, such that the second pitch is different than the first pitch;

a second process of:

using a mask to lithographically define a plurality of gates including the second gate adjacent to the first gate on the substrate, the third gate adjacent to the second gate on the substrate, and an intermediate gate between the first and second gates on the substrate, a pitch between the plurality of gates comprising the same pitch; and

removing the intermediate gate such that the second pitch is different than the first pitch; and

a third process of using a mask to lithographically define a second gate adjacent to the first gate on the substrate, such that the second gate has a channel length which is less than a channel length of the first gate,

wherein the first FET further comprises:

first and second diffusion regions formed in the substrate on a side of the first gate; and

first and second contacts which contact the first and second diffusion regions, respectively, the first contact being asymmetric with respect to the second contact.

17. The method of making a semiconductor device of claim 16 , wherein the first and third gates have a first gate length, and the second gate has a second gate length which is less than first gate length.

18. The method of making a semiconductor device of claim 16 , wherein the asymmetry of the first and second contacts comprises one of:

the first contact is located a first distance from the first gate, and the second contact is located a second distance from the first gate, the second distance being different than the first distance;

the first contact comprises a first volume, and the second contact comprises a second volume, the second volume being different than the first volume;

the first contact comprises a first material, and the second contact comprises a second material, the second material being different than the first material; and

the first contact comprises one of a stressed and unstressed contact, and the second contact comprises the other one of the stressed and unstressed contact.