IP Library Granted Patent US 8,378,456
Granted Patent B1
US 8,378,456 · App. 13/199,437 · Granted Feb 19, 2013

Unified switch array for memory devices

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Quick Facts
Patent No.
US 8,378,456
App. No.
13/199,437
Granted
Feb 19, 2013
Kind
B1
Abstract

An array of vertically constructed, electronic switches is disclosed having three, four or more contacts and having a common bottom contact and a plurality of common middle contacts. This switch array will find use in memory devices or display devices.

Claims (20)

1. A two dimensional array of switches comprising three or more layers of alternating polarity doped semiconductor material whereby the bottom layer is continuous among switches in two dimensions, the top layer is isolated across switches in two dimensions, and at least one intervening layer is continuous among switches in one dimension and isolated in the other dimension.

2. The array of switches of claim 1 whereby the bottom common contact has low resistance.

3. The array of switches of claim 1 whereby the layers within a given switch cooperate to form a vertical transistor.

4. The array of switches of claim 3 whereby the transistors are the bipolar type.

5. The transistors of claim 4 whereby said transistors have sufficient gain to allow operation when the center common contact has moderate or high resistance.

6. The array of switches of claim 1 whereby the layers within a given switch cooperate to form four-layer diodes or SCR's.

7. The switches of claim 6 whereby the four-layer diodes or SCR's have sufficient gain to allow operation when the center common contact(s) has moderate or high resistance.

8. The switches of claim 1 whereby a reference voltage is applied a middle layer of some of the switches in the array.

9. The array of switches of claim 1 whereby the switches are operated to select a memory cell in a memory device.

10. The array of switches of claim 1 whereby the switches are operated to select a pixel cell in a display device.

11. The array of switches of claim 1 whereby the switches are operated to select a sensing cell in a sensor device.

12. A semiconductor memory device comprising a two dimensional array of switches fabricated out of three or more layers of alternating polarity doped semiconductor material whereby the bottom layer is continuous among switches in two dimensions, the top layer is isolated across switches in two dimensions, and at least one intervening layer is continuous among switches in one dimension and isolated in the other dimension.

13. The memory device of claim 12 wherein at least one storage location is programmed with data comprising at least one of music, video, computer software, a computer application, reference data, text, or a diagram.

14. The memory device of claim 12 wherein the device is disposed within a package that is removable and interchangeable among a plurality of host devices.

15. The memory device of claim 12 wherein bit information is retained at a given memory cell by a phase-change material.

16. The memory device of claim 15 wherein the phase-change material is a Chalcogenide alloy.

17. The memory device of claim 12 wherein bit information is retained at a given memory cell by a magnetic or magnetoresistive material.

18. The memory device of claim 12 wherein bit information is retained at a given memory cell by utilizing a magnetic tunnel junction or spin-transfer torque element.

19. The memory device of claim 12 wherein bit information is retained at a given memory cell by utilizing a fuse or antifuse material.

20. A method for forming a two dimensional array of switches comprising the steps of (i) creating three or more layers of alternating polarity doped semiconductor material by deposition, epitaxial growth and/or implantation, (ii) performing a first etch to form a first plurality of spaces between rows of switches such that the etch stops upon or within a low level layer, (iii) performing a second etch to individually define the tops of each switch such that the bottom of said second etch stops upon or within a layer that is below a high level layer and above said low level layer, such that said low level layer is continuous among switches in two dimensions, the high level layer is isolated across switches in two dimensions, and at least one intervening layer is continuous among switches in one dimension and isolated in the other dimension.

Assignments (17)
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 039389 FRAME 0684 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0535 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2018
From: HGST, INC.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 046939/0587 →
RELEASE OF SECURITY INTEREST Recorded Aug 16, 2016
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HGST, INC.
Reel/Frame 039689/0950 →
SECURITY AGREEMENT Recorded Jul 19, 2016
From: HGST, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039389/0684 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME AND ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 035748 FRAME 0909. ASSIGNOR(S) HEREBY CONFIRMS THE NAME AND ADDRESS OF THE ASSIGNEE SI HGST, INC.,3403 YERBA BUENA ROAD,SAN JOSE, CA 95135. Recorded Jun 2, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST, INC.
Reel/Frame 035831/0594 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST NETHERLANDS B.V.
Reel/Frame 035748/0909 →
RELEASE OF SECURITY INTEREST Recorded May 20, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035749/0956 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035685/0571 →
RELEASE OF SECURITY INTEREST Recorded Jun 24, 2014
From: AMERICAN CAPITAL, LTD.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 033225/0330 →
SECURITY INTEREST Recorded Jun 20, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.; PERRIN, DONALD; RUNNING DEER FOUNDATION; RUNNING DEER TRUST
Reel/Frame 033204/0428 →
SECURITY INTEREST Recorded May 30, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.
Reel/Frame 033063/0617 →
SECURITY AGREEMENT Recorded Jan 18, 2013
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; RUNNING DEER TRUST; RUNNING DEER FOUNDATION; SARAH G. KURZON 2001 REVOCABLE TRUST; PERRIN, DONALD
Reel/Frame 029659/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2012
From: SHEPARD, DANIEL R.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 029223/0843 →