IP Library Granted Patent US 10,044,353
Granted Patent B2
US 10,044,353 · App. 13/206,689 · Granted Aug 7, 2018

Substantially edgeless touch sensor

Inventors: Esat Yilmaz (Santa Cruz, CA); Jalil Shaikh (Fremont, CA)
Assignee: Atmel Corporation
H03K17/9622G06F3/041G06F3/044H03K2217/96031H03K2217/960755
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Quick Facts
Patent No.
US 10,044,353
App. No.
13/206,689
Granted
Aug 7, 2018
Kind
B2
Abstract

In one embodiment, an apparatus includes a substrate configured to extend substantially out to at least two edges of a surface of a device. The apparatus also includes a touch sensor disposed on the substrate, the touch sensor comprising an active area that is configured to extend substantially out to at least two of the edges of the surface of the device.

Claims (47)

1. An apparatus comprising:

a substrate configured to extend substantially out to at least four edges of a first surface of a device, the substrate further configured to wrap around at least a first edge and a second edge of the at least four edges of the first surface of the device;

a touch sensor disposed on the substrate, the touch sensor comprising:

an active area that is configured to extend substantially out to the at least four edges of the first surface of the device; and

a plurality of electrodes comprising a first plurality of electrodes configurable to operate as drive electrodes and a second plurality of electrodes configurable to operate as sense electrodes, the first plurality of electrodes having a U shape and being arranged in a first plurality of columns, the second plurality of electrodes having a T shape and being arranged in the first plurality of columns, each of the first plurality of electrodes and each of the second plurality of electrodes forming a plurality of capacitive nodes at respective positions in which one of the first plurality electrodes having the U shape is interdigitated with one of the second plurality of electrodes having the T shape; and

a plurality of bond pads located at a second surface of the device, the second surface facing a different direction than the first surface and corresponding to the portions of the substrate wrapping around the first edge of the at least four edges of the first surface of the device, each of the plurality of bond pads configured to couple to a corresponding bond pad on one or more flexible printed circuits (FPCs);

wherein:

the substrate comprises a plurality of tracking areas where tracks providing connections to and from the plurality of electrodes of the touch sensor are disposed on the substrate, the tracks of the plurality of tracking areas extending to the first edge of the first surface of the device and wrapping around the first edge onto the second surface of the device to provide respective connections to and from control circuitry, the tracks including a respective track in each of the plurality of columns providing a connection to all of the first plurality of electrodes arranged in respective column of the plurality of columns; and

at least one of the plurality of tracking areas is configured to extend into the active area of the touch sensor in a gap formed between at least two adjacent columns of the plurality of columns such that multiple tracks, each providing a connection to a corresponding electrode of the second plurality of electrodes in a column, of the at least one tracking area are positioned, in plan view, in the gap formed between the at least two adjacent columns of the plurality of columns, the multiple tracks being substantially parallel in the gap along at least a portion of respective lengths of the multiple tracks, the multiple tracks of the at least one of the plurality of tracking areas configured to wrap around, with the substrate, the first edge of the first surface of the device onto the second surface of the device to provide the respective connections to or from the control circuitry, each of the multiple tracks extending in a first direction from the gap to the first edge, each of the multiple tracks configured to respectively couple to each of the plurality of bond pads at the second surface of the device, the at least two adjacent columns of the plurality of columns being adjacent in that an electrode of the first plurality of electrodes or the second plurality of electrodes is not positioned in the gap between the at least two adjacent columns of the plurality of columns.

2. The apparatus of claim 1 , wherein:

the substrate is further configured to wrap around a third edge of the at least four edges of the first surface of the device; and

the touch sensor is configured to wrap around the first, second, and third edges of the first surface of the device with the substrate, the wrapping of the touch sensor around the first, second, and third edges at least in part enabling the active area of the touch sensor to extend substantially out to the first, second, and third edges of the first surface of the device.

3. The apparatus of claim 2 , wherein one or more portions of one or more of the plurality of tracking areas are configured to be located on a third surface of the device on a side of the third edge of the device around which the substrate is configured to wrap.

4. The apparatus of claim 1 , wherein the first surface of the device is flat or curved.

5. The apparatus of claim 1 , wherein the touch sensor comprises:

a single-layer configuration with the first plurality of electrodes and second plurality of electrodes disposed only on one side of a single substrate;

a single-layer configuration with the first plurality of electrodes disposed on a first side of a single substrate and the second plurality of electrodes disposed on a second side of the single substrate opposite the first side; or

a two-layer configuration with the first plurality of electrodes disposed on one side of a first substrate and the second plurality of electrodes disposed on one side of a second substrate.

6. The apparatus of claim 1 , wherein the touch sensor is a mutual-capacitance touch sensor or a self-capacitance touch sensor.

7. The apparatus of claim 1 , wherein the plurality of electrodes comprises electrodes each made of substantially flexible conductive material comprising a conductive mesh of conductive metal lines.

8. The apparatus of claim 1 , wherein one or more portions of one or more of the tracks are made of conductive material comprising a conductive mesh of conductive metal lines.

9. The apparatus of claim 1 , wherein one or more of the plurality of electrodes are made of indium tin oxide (ITO).

10. The apparatus of claim 1 , wherein one or more portions of one or more of the tracks are made of indium tin oxide (ITO).

11. The apparatus of claim 1 , wherein the tracks are made of fine lines of metal and have a width of approximately 100 μm or less.

12. A device comprising:

a substrate configured to extend substantially out to at least two edges of a first surface of a device, the substrate further configured to wrap around at least a first edge and a second edge of the at least two edges of the first surface of the device;

a touch sensor disposed on the substrate, the touch sensor comprising an active area that is configured to extend substantially out to the at least two of the edges of the first surface of the device;

a plurality of bond pads located at a second surface of the device, the second surface facing a different direction than the first surface and corresponding to portions of the substrate wrapping around the first edge of the at least four edges of the first surface of the device, each of the plurality of bond pads configured to couple to a corresponding bond pad on one or more flexible printed circuits (FPCs); and

one or more computer-readable non-transitory storage media embodying logic that is configured when executed to control the touch sensor;

wherein:

the substrate comprises one or more tracking areas where tracks providing drive or sense connections to or from drive or sense electrodes of the touch sensor are disposed on the substrate, the drive electrodes having a U shaped and being arranged in columns, the sense electrodes having a T shaped and being arranged in the columns, each of the drive electrodes and each of the sense electrodes forming capacitive nodes at respective positions in which one of the drive electrodes having the U shaped is interdigitated with one of the sense electrodes having a T shaped, the tracks including a respective track in each of the columns providing a connection to all of the drive electrodes arranged in a respective column of the columns; and

at least one of the one or more tracking areas is configured to extend into the active area of the touch sensor in a gap formed between two of the columns such that multiple tracks, each providing a connection to a corresponding sense electrode, of the tracking area are positioned, in plan view, in the gap formed between the two columns, the multiple tracks being substantially parallel in the gap along at least a portion of respective lengths of the multiple tracks, the multiple tracks of the at least one of the one or more tracking areas configured to wrap around, with the substrate, the first edge of the first surface of the device onto the second surface of the device to provide respective connections to or from control circuitry, each of the multiple tracks extending in a first direction from the gap to the first edge, each of the multiple tracks configured to respectively couple to each of the plurality of bond pads at the second surface of the device, the two columns being adjacent in that neither a drive electrode nor a sense electrode is positioned in the gap between the two columns.

13. The device of claim 12 , wherein:

the substrate is further configured to wrap around a third edge of the at least two edges of the first surface of the device; and

the touch sensor is configured to wrap around the first, second, and third edges of the at least two edges of the first surface of the device with the substrate, the wrapping of the touch sensor around the first, second, and third edges of the at least two edges at least in part enabling the active area of the touch sensor to extend substantially out to the first, second, and third edges of the at least two edges of the first surface of the device.

14. The device of claim 13 , wherein one or more portions of the one or more tracking areas are configured to be located on a third surface of the device on a side of the third edge of the device that the substrate is configured to wrap around.

15. The device of claim 12 , wherein the first surface of the device is flat or curved.

16. The device of claim 12 , wherein the touch sensor comprises:

a single-layer configuration with drive and sense electrodes disposed only on one side of a single substrate;

a single-layer configuration with drive electrodes disposed on a first side of a single substrate and sense electrodes disposed on a second side of the single substrate opposite the first side; or

a two-layer configuration with drive electrodes disposed on one side of a first substrate-and sense electrodes disposed on one side of a second substrate.

17. The device of claim 12 , wherein the touch sensor is a mutual-capacitance touch sensor or a self-capacitance touch sensor.

18. The device of claim 12 , wherein the touch sensor comprises drive or sense electrodes made of substantially flexible conductive material comprising a conductive mesh.

19. The device of claim 12 , wherein one or more portions of one or more of the tracks disposed on the substrate providing drive or sense connections to or from drive or sense electrodes of the touch sensor are made of conductive material comprising a conductive mesh of conductive metal lines.

20. The device of claim 12 , wherein one or more portions of one or more of the tracks disposed on the substrate providing drive or sense connections to or from drive or sense electrodes of the touch sensor are located outside a visible area of the touch sensor and are made of conductive material.

21. The device of claim 12 , wherein the touch sensor comprises drive or sense electrodes made of indium tin oxide (ITO).

22. The device of claim 12 , wherein one or more portions of one or more of the tracks disposed on the substrate providing drive or sense connections to or from drive or sense electrodes of the touch sensor are made of indium tin oxide (ITO).

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2019
From: MICROCHIP TECHNOLOGY INC.; ATMEL CORPORATION; MICROCHIP TECHNOLOGY GERMANY GMBH
To: NEODRÓN LIMITED
Reel/Frame 048259/0840 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0884 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0937 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2011
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 026833/0250 →
CHANGE OF NAME Recorded Aug 31, 2011
From: QRG LIMITED
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 026833/0235 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2011
From: SHAIKH, JALIL
To: ATMEL CORPORATION
Reel/Frame 026726/0818 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2011
From: YILMAZ, ESAT
To: QRG LIMITED
Reel/Frame 026726/0849 →
Continuity (1)
Related Publication 20130038563A1 · Feb 14, 2013