Integrated circuit system with test pads and method of manufacture thereof

1. A method of manufacture of an integrated circuit system comprising:

providing a substrate having a test pad with a gap between element pads, the element pads having top surfaces and non-horizontal surfaces intersecting the top surfaces;

forming a conductive layer over the test pad, the conductive layer having element layers directly on the top surfaces and portions of the non-horizontal surfaces; and

mounting an integrated circuit over the substrate.

2. The method as claimed in claim 1 wherein forming the conductive layer includes forming the conductive layer having a bridge connected to one of the element layers and another of the element layers.

3. The method as claimed in claim 1 wherein providing the substrate includes providing the substrate having the element pads with rectangular shapes.

4. The method as claimed in claim 1 wherein providing the substrate includes providing the substrate having the element pads with circular shapes.

5. The method as claimed in claim 1 wherein providing the substrate includes providing the substrate having the element pads with triangular shapes.

6. A method of manufacture of an integrated circuit system comprising:

providing a substrate having a test pad with a gap between element pads, the element pads having top surfaces and non-horizontal surfaces intersecting the top surfaces;

forming a conductive layer over the test pad, the conductive layer having element layers directly on the top surfaces and portions of the non-horizontal surfaces;

mounting an integrated circuit over the substrate; and

attaching a system connector to the substrate.

7. The method as claimed in claim 6 wherein forming the conductive layer includes forming the conductive layer having a bridge connected to one of the element layers and another of the element layers, the bridge directly over the gap.

8. The method as claimed in claim 6 wherein providing the substrate includes providing the substrate having an area array of the element pads with rectangular shapes.

9. The method as claimed in claim 6 wherein providing the substrate includes providing the substrate having the gap between the element pads with circular shapes.

10. The method as claimed in claim 6 wherein providing the substrate includes providing the substrate having the element pads with shapes of a right triangle.

11. An integrated circuit system comprising:

a substrate having a test pad with a gap between element pads, the element pads having top surfaces and non-horizontal surfaces intersecting the top surfaces;

a conductive layer over the test pad, the conductive layer having element layers directly on the top surfaces and portions of the non-horizontal surfaces; and

an integrated circuit over the substrate.

12. The system as claimed in claim 11 wherein the conductive layer includes a bridge connected to one of the element layers and another of the element layers.

13. The system as claimed in claim 11 wherein the substrate includes the element pads with rectangular shapes.

14. The system as claimed in claim 11 wherein the substrate includes the element pads with circular shapes.

15. The system as claimed in claim 11 wherein the substrate includes the element pads with triangular shapes.

16. The system as claimed in claim 11 further comprising a system connector attached to the substrate.

17. The system as claimed in claim 16 wherein the conductive layer includes a bridge connected to one of the element layers and another of the element layers, the bridge directly over the gap.

18. The system as claimed in claim 16 wherein the substrate includes an area array of the element pads with rectangular shapes.

19. The system as claimed in claim 16 wherein the substrate includes the gap between the element pads with circular shapes.

20. The system as claimed in claim 16 wherein the substrate includes the element pads with shapes of a right triangle.