Semiconductor chip with backside conductor structure
View Patent ↗Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway.
1. An apparatus, comprising:
a semiconductor chip including a base substrate having a backside, a semiconductor device layer, and a buried insulating layer positioned between the base substrate and the semiconductor device layer;
a conductor structure positioned in a bore extending from the backside of the base substrate completely through the buried insulating layer and to, but not through, the semiconductor device layer to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure; and
a diagnostic instrument directly electronically coupled to the conductor structure and directly electronically coupled to the semiconductor device layer.
2. The apparatus of claim 1 , wherein the conductor structure comprises a first conductive layer in the bore and a second conductive layer on the first conductive layer.
3. The apparatus of claim 2 , wherein the first conductive layer comprises a graphite colloid.
4. The apparatus of claim 2 , wherein the first conductive layer comprises a metal.
5. The apparatus of claim 1 , wherein the semiconductor device layer includes an area of interest, the conductor structure being positioned proximate the area of interest.
6. The apparatus of claim 1 , wherein the diagnostic instrument comprises a scanning probe microscope.