Variable impedance memory device structure and method of manufacture including programmable impedance memory cells and methods of forming the same

1. A programmable impedance memory device structure, comprising:

a multi-layer variable impedance memory element formed on a planar surface of a first barrier layer, the multi-layer variable impedance memory element comprising a plurality of layers substantially parallel to the planar surface throughout the memory element, and including a memory material layer in physical contact with the planar surface of the first barrier layer, the first barrier layer being formed above and in physical contact with a first insulating layer; and

a second barrier layer formed over the memory element having a top surface substantially parallel with the planar surface of the first barrier layer; wherein

the first and second barrier layers have lower mobility rates for at least one element within the memory material layer than the first insulating layer, the memory material layer is programmable by application of an electrical field between at least two different impedance states, and the first insulating layer is formed from a different material than the first barrier layer.

2. The memory device of claim 1 , wherein

the first barrier layer is an insulating film.

3. The memory device of claim 2 wherein

the first barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride; and

the first insulating film comprises silicon dioxide.

4. The memory device of claim 1 , wherein

the second barrier layer is an insulating film.

5. The memory device of claim 4 , wherein

the second barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride; and

the first insulating film comprises silicon dioxide.

6. The memory device of claim 1 , wherein

the multi-layer variable impedance memory element includes

the memory material comprising an ion conductor layer, and

an ion source layer formed on the ion conductor layer that includes at least one element ion conductible in the ion conductor.

7. The memory device of claim 1 , wherein

the multi-layer variable impedance memory element includes

a conductive barrier layer formed over an ion conductor layer, and

a top conductive interconnect formed over and in contact with the conductive barrier layer, wherein

the conductive barrier layer is selected to prevent the top conductive interconnect from extending into the ion source layer or ion conductor layer.

8. The memory device of claim 7 , wherein

the conductive barrier layer comprises titanium nitride;

the ion source layer comprises a metal selected from: silver and copper; and

the ion conductor layer comprises germanium disulfide.

9. The memory device of claim 8 , wherein

the first and second barrier layers comprises a material selected from the group of: silicon nitride and silicon oxynitride;

the ion conductor layer comprises germanium disulfide; and

the first insulating layer comprises silicon dioxide.

10. The memory device of claim 1 , further including

a top insulating layer formed over the second barrier layer; and

the first and second barrier layers have lower mobility rates for the at least one element within the memory material layer than the top insulating layer.

11. The memory device of claim 10 , wherein

the top insulating layer comprises silicon dioxide.

12. A programmable impedance memory structure, comprising:

a first barrier layer formed over and in physical contact with a first insulating layer and having a top planar surface;

a memory cell structure comprising

a first memory layer comprising a metal oxide that is programmable between at least two different impedance states by application of electrical fields, and formed over and in physical contact with the first barrier layer, and

a second memory layer comprising a conductive material and formed over the first memory layer; and

a second barrier layer formed over the memory cell structure; wherein

the first and second barrier layers are parallel to the top surface of the first barrier layer, and have lower mobility rates for an element of the memory cell structure than the first insulating layer, and the first and second memory layers are substantially parallel to the top planar surface throughout the memory cell structure.

13. The programmable impedance memory structure of claim 12 , wherein:

the first barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride; and

the second barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride.

14. The programmable impedance memory structure of claim 12 , wherein:

the first barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride;

the second memory layer comprises a material selected from the group of: silver and copper; and

the second barrier layer comprises a material selected from the group of: silicon nitride and silicon oxynitride.

15. The programmable impedance memory structure of claim 12 , wherein:

the second memory layer comprises an ion source layer that provides at least one element that is ion conductible in the first memory layer.

16. The programmable impedance memory structure of claim 12 , further including:

at least one conductive element formed in the first insulating layer and extending through the first barrier layer to contact the first memory layer.

17. The programmable impedance memory structure of claim 16 , wherein:

the conductive element has a top surface that is coplanar with the top surface of the first barrier layer.

18. The programmable impedance memory structure of claim 16 , wherein:

the conductive element comprises tungsten.

19. The programmable impedance memory structure of claim 16 , further including:

the conductive element has a bottom portion in contact with a lower interconnect pattern.

20. A programmable impedance memory structure, comprising:

a first barrier layer formed over and in physical contact with a first insulating layer and having a top planar surface;

a memory cell structure comprising

a memory layer formed over and in physical contact with the first barrier layer that is programmable between at least two different impedance states by application of electrical fields, and

an ion source layer formed over the memory layer; and

a second barrier layer formed over the memory cell structure; wherein

the first and second barrier layers are parallel to the top surface of the first barrier layer, and have lower mobility rates for an element of the memory cell structure than the first insulating layer, and the memory layer and ion source layer are substantially parallel to the top planar surface throughout the memory cell structure.

21. The programmable impedance memory structure of claim 20 , wherein:

the memory comprises a metal oxide.

22. The programmable impedance memory structure of claim 20 , wherein:

the ion source layer comprises at least one metal that is ion conductible in the memory layer.

23. The programmable impedance memory structure of claim 20 , further including:

the memory cell structure further includes a conductive barrier layer formed over the ion source layer;

an upper insulating layer formed over the conductive barrier layer; and

at least one upper metallization extending through the upper insulating layer and second barrier layer to contact the conductive barrier layer, but not extend through the conductive barrier layer.

24. The programmable impedance memory structure of claim 23 , wherein:

the conductive barrier layer comprises titanium nitride.

25. The programmable impedance memory structure of claim 20 , further including:

at least one conductive element that extends through the first insulating layer and the first barrier layer to contact the memory layer.

26. The programmable impedance memory structure of claim 25 , further including:

an interconnect layer formed below and in contact with the conductive element.

27. The programmable impedance memory structure of claim 26 , further including:

conductive contacts formed below and in contact with the interconnect layer, the conductive contacts providing a conductive path to active devices.