IP Library Granted Patent US 8,185,863
Granted Patent B2
US 8,185,863 · App. 13/243,070 · Granted May 22, 2012

Delay fault test quality calculation apparatus, delay fault test quality calculation method, and delay fault test pattern generation apparatus

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Quick Facts
Patent No.
US 8,185,863
App. No.
13/243,070
Granted
May 22, 2012
Kind
B2
Abstract

A delay fault test quality calculation apparatus for calculating delay fault test quality to be achieved by a test pattern to be applied to a semiconductor integrated circuit includes a defect distribution extraction unit, a delay fault-layout element information extraction unit, and a weighting unit. The delay fault test quality calculation apparatus further includes a delay fault test quality calculation unit which calculates the delay fault test quality on the basis of delay design information of the semiconductor integrated circuit, detection information of the test pattern to test the semiconductor integrated circuit, execution conditions of the test, a physical defect distribution extracts the defect distribution extraction unit, and a weights adds the weighting unit.

Claims (49)

1. A delay fault test pattern generation apparatus for generating a delay fault test pattern, comprising:

a defect distribution extraction unit which extracts a physical defect distribution of resistances or currents caused by a physical defect related to layout elements or a combination of the layout elements composing the semiconductor integrated circuit;

a delay fault-layout element information extraction unit which extracts the layout elements or the combination of the layout elements with interconnect wiring information including location information, interconnect capacitance and a delay fault to be associated with inside the semiconductor integrated circuit as delay fault-layout element information by associating the layout elements or the combination thereof with delay faults to be assumed inside the semiconductor integrated circuit, the delay fault resulting from a value obtained from the resistance and interconnect capacitance of the layout element or the combination thereof;

a delay defect distribution calculation and weighting unit which calculates a distribution of delay defect on the basis of the distribution of the resistance or current and adds weight to each of the delay faults on the basis of the delay fault-layout element information;

a test pattern generation unit which preferentially generates the delay fault test pattern for un-detected delay faults with large weight on the basis of weight of the delay faults to which the weight is added by the delay defect distribution calculation and weighting unit; and

a delay fault test quality calculation unit which calculates the delay fault test quality on the basis of delay design information of the semiconductor integrated circuit, detection information of the test pattern to test the semiconductor integrated circuit, execution conditions of the test, the delay defect distribution of resistance or current caused by physical defects, and the weights.

2. The delay fault test pattern generation apparatus according to claim 1 , wherein

the delay defect distribution calculation and weighting unit obtains a distribution of delay defect caused by a distribution of resistance caused by physical defects of VIAs to each delay fault by using a resistance into delay conversion formula.

3. The delay fault test pattern generation apparatus according to claim 2 , wherein

the resistance into delay conversion formula is expressed by an equation as follows:

D ( i,k {j} ,R )= C ( i,k {j} )× fLOC ( i,k {j} )× R

[VIAk on net (i)]

[{j}=(partial) aggregate of delay faults assumed at a connection destination basic cell input terminals of net (i)]

wherein, fLOC is detailed position information of each VIA inside an LSI logical net (i).

4. The delay fault test pattern generation apparatus according to claim 1 , wherein

the delay fault test quality calculation unit calculates the delay fault test quality by an equation expressed as follows:

DL

(

i

)

=

Tmgn

(

i

)

Tdet

(

i

)

F

(

D

)

D

[delay fault test quality of (input) fault i]

DL(LSI)=Σ i DL(i)

(delay fault test quality of whole of semiconductor integrated circuit)

wherein, F(D) is the delay defect distribution, Tmgn(i) is delay design information of the semiconductor integrated circuit, Tdet(i) is detection information of the test pattern.

5. The delay fault test pattern generation apparatus according to claim 1 , wherein

the delay defect distribution is continuously obtained by measuring test element groups for evaluation at shipment tests of products, and by accumulating the measurement results.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 044762/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2016
From: KABUSHIKI KAISHA TOSHIBA; FUJITSU SEMICONDUCTOR LIMITED
To: KABUSHIKI KAISHA TOSHIBA; SOCIONEXT INC.
Reel/Frame 038197/0037 →
CHANGE OF ADDRESS Recorded Apr 5, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 038361/0492 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: NOZUYAMA, YASUYUKI; TAKATORI, ATSUO
To: KABUSHIKI KAISHA TOSHIBA; FUJITSU LIMITED
Reel/Frame 027126/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 027126/0246 →
CHANGE OF NAME Recorded Oct 26, 2011
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027129/0001 →