Semiconductor device and the method of manufacturing the same
View Patent ↗A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer ( 22 ) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet ( 21 ) supported by a wafer ring ( 23 ); a step of fixing the wafer ring ( 23 ) after transferring the wafer ring to a table ( 14 ) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer ( 22 ) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.
1. A semiconductor device comprising:
a semiconductor substrate having an element region formed therein and including a first main surface and a second main surface opposite to each other;
a wiring layer provided on a side of the first main surface of the semiconductor substrate and connected to the element region; and
a marking formed by applying a laser on the second main surface of the semiconductor substrate, wherein
the marking is provided with a plurality of recesses separated from each other by peripheral portions,
carbide of resin regions are directly attached to the plurality of recesses and the peripheral portions as a continuous layer, and
one of the carbide of resin regions adjacent to another one of the carbide of resin regions partially overlap each other.
2. The semiconductor device according to claim 1 , wherein the carbide of resin regions comprises a material formed by carbonizing an insulating adhesive.
3. The semiconductor device according to claim 1 , wherein the plurality of recesses each have a circular shape in a plan view, and each of the plurality of recesses and the carbide resin regions thereof are arranged concentrically with each other.
4. The semiconductor device according to claim 1 , wherein a semiconductor material is exposed in a region other than the region covered by the carbide resin regions.
5. A semiconductor device comprising:
a semiconductor substrate having an element region formed therein and including a first main surface and a second main surface opposite to each other;
a wiring layer provided on a side of the first main surface of the semiconductor substrate and connected to the element region; and
a marking structure on the second main surface of the semiconductor substrate, the marking structure comprising:
a plurality of recesses extending generally inward from the second main surface, wherein each recess is separated by portions of the second main surface, and
a carbide layer lining the plurality of recesses and overlapping the portions of the second main surface as a continuous layer, wherein the carbide layer comprises a plurality of carbonized regions, and wherein one of the carbonized regions adjacent to another one of the carbonized regions partially overlap each other.
6. The semiconductor device of claim 5 , wherein the carbide layer comprises a carbonized adhesive.
7. The semiconductor device of claim 6 , wherein the carbonized adhesive is formed by applying a laser on the second main surface while an insulating adhesive sheet is attached to the second main surface.
8. The semiconductor device of claim 5 , wherein the carbide layer comprises an acryl resin.
9. The semiconductor device of claim 5 , wherein the carbide layer includes at least seven percent by weight of carbon.
10. The semiconductor device of claim 5 , wherein the marking structure comprises a position mark and a sign mark.
11. The semiconductor device of claim 5 , wherein the recesses are linearly arranged and separated at substantially equal intervals.
12. The semiconductor device of claim 5 , wherein the plurality of recesses each have a circular shape in a plan view, and each of the plurality of recesses and the carbonized regions are arranged concentrically with each other.
13. The semiconductor device of claim 5 , wherein the carbide layer only partially covers the second main surface.
14. A semiconductor device comprising:
a semiconductor substrate having an element region formed therein and including a first main surface and a second main surface opposite to each other;
a wiring layer provided on a side of the first main surface of the semiconductor substrate and connected to the element region; and
a marking structure on the second main surface of the semiconductor substrate, the marking structure comprising:
a plurality of recesses extending generally inward from the second main surface and separated from each other by peripheral portions on the second main surface, and
a plurality of carbonized regions configured as a continuous layer directly on the plurality of recesses and directly on the peripheral portions, wherein one of the carbonized regions adjacent to another one of the carbonized regions partially overlap each other.
15. The semiconductor device of claim 14 , wherein each of the plurality of carbonized regions comprises a carbonized adhesive.
16. The semiconductor device of claim 15 , wherein the carbonized adhesive is formed by applying a laser on the second main surface while an insulating adhesive sheet is attached to the second main surface.
17. The semiconductor device of claim 14 , wherein the plurality of recesses is linearly arranged and separated at substantially equal intervals.
18. The semiconductor device of claim 14 , wherein each recess has a circular shape in a plan view, and wherein each recess and each carbonized region are arranged concentrically with each other.
19. The semiconductor device of claim 14 , wherein the plurality of carbonized regions only partially covers the second main surface.